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In these boundaries, the contravariant velocity components normal to the boundary are constrained by mass conservation, and for other velocity components and turbulent quantities, the second derivatives are set to zero.

在这些界限， contravariant速度组分正常对界限由许多保护压抑，并且为其他速度组分和动荡数量，第二种衍生物调整到零。

In the present ap-proach, the Cartesian components of the velocity are kept as the dependent variables, since the choice of the covariant or the contravariant velocity components would lead to a much more complex set of equations.

在当前方法，因为协变量的选择或contravariant速度组分将导致等式，复杂的形势速度的解析的组分被保留作为因变量。

In this paper, a "rigid bar relative movement model" was established to illustrate the traces of the helices in wire ropes. The angular speed of a moving particle of the model was relatives to curvature tensor to derive the curvature components and torsion of helices in multi-layer wire ropes. According to long and thin rod theory of Love and Yen-Chen's theoretical model considered the contact force and frictional force, the force-deformation or force-strain relative of wire in curved wire ropes subjected axial force is derived from the curvature components and curvature increment.

本研究改以刚杆相对运动模型，直接描述钢索中钢绞线轨迹，并且透过角速度类比曲率张量之概念，推导圆弧型多层钢索内部之钢铰线之曲率分量与扭率；之后再依据Love的细长杆理论，辅以Yen-Chen在考虑接触力及摩擦力下所修正之理论模型，以曲率及曲率增量来探讨圆弧型钢索受静态荷重作用下，钢绞线之受力与变形或应变关系。

Firstly, chaotic kinetic characteristic of Kent mapping is analyzed, using it to encrypt watermark image; Secondly, an algorithm of only modifying the decimal part of DC components is given, bringing the least error, effectively solving the problem which embedding watermark in DC components is easy to the image's block effect; Watermark is extracted without original image utilizing two-bits algorithm.

深入分析了帐篷映射的混沌动力学特性，并将其应用于水印图像的预处理；在分析了 DCT域嵌入对策的基础上提出了一种只修改 DC 分量小数部分的嵌入算法，引入的误差小，有效的解决了以往人们在 DC 分量嵌入水印容易引起图像块效应的问题；检测过程中利用二值离散算法使得水印提取时无需原始图像。

And experts paid more attentions to integer perception while listening to music.3. It also showed the position effect, that was irregular chords appeared at the third or fifth position, and the swings and the delitescence were quite different. It uncovered the different neural modes at different music perception phases.4. The two components had no significant differences with their swings at the three attention levels. It meant that these two ERP components could be acquired under non-attention condition, and music processing was automatic.

更多伏期更早，表明在时间维度和程度上，专家的整合程度要优于一般被试，专家更加注重对音乐的整体知觉。3通过违例和弦出现位置的不同，如违例和弦分别出现在第三位置和第五位置上的对比研究，发现第五位置上产生的ERAN和N5比第三位置上产生的振幅更大，表明这两种成分受违例位置的影响，揭示了音乐知觉不同阶段认知神经模型的差异。4这两种成分在三种注意水平下没有显著性差异，表明这两种ERP成分在非注意条件下就能够产生，人类的音乐加工是自动的。

As is now well known,foundry coating is consist of 5 kinds of basic components such as carrier material,refractory fillings, defocculaing aent, binding agent and accessorial addition agent. In which the refractory fillings is its main components that it decides the refractoriness,chemical stability, diathermancy of the coating ,simultaneously it influences also the gas permeability,sinter delaminating property of the coating.

众所周知，铸造涂料是由载体，耐火填料，悬浮剂，粘结剂和辅助添加剂五种基本组分组成，其中耐火填料为主要组分，它决定着涂料的耐火度，化学稳定性，绝热性，对涂料的透气性，烧结剥离性也有重要影响。

As is now well known,foundry coating is consist of 5 kinds of basic components such as carrier material,refractory fillings, defocculaing aent, binding agent and accessorial addition agent. In which the refractory fillings is its main components that it decides the refractoriness,chemical stability, diathermancy of the coating , simultaneously it influences also the gas permeability,sinter delaminating property of the coating.

众所周知，铸造涂料是由载体、耐火填料、悬浮剂、粘结剂和辅助添加剂五种基本成份组成，其中耐火填料为主要组分，它决定着涂料的耐火度、化学稳定性、绝热性，对涂料的透气性、烧结剥离性也有重要影响。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

Instantiating the architecture of open CNC system to data communication components Currently, there are four types of describing and expressing software architecture:(1) figure expression drawing with rectangles and directed line segments;(2) path language in module that links traditional programming language module;(3) special software architecture description language combining object-oriented technology with the development experience of traditional program design language;(4) system description language based on components.

instantiating结构的开放式数控系统的数据通信元件目前，共有四种不同类型的描述和表示软件体系：(1)数字表达绘画rectangles定向线段；(2)路径语言模块连接传统的编程语言模块；特殊软件构架描述语言结合面向对象技术与发展经验的传统程序设计语言；(4)系统描述语言的组件。

Active components belong to a group called discrete components, which perform a single function, e.g. regulate current or switch signals.

有源元件属于一个被称为分立元件的组别，完成单一功能，例如整流或转换信号。

Objective To investigate the effects of interleukin-1 β converting enzyme gene on the biologic characteristics of ovarian cancer cells.

目的 探讨白细胞介素-1 β转换酶的表达，对卵巢癌细胞生物学特性的影响。

Campylobacter: This illness is the most commonly identified cause of diarrheal illness in the world.

弯曲：这种病是最常见的原因查明腹泻病，在世界上。