模块性

Thus, the experiment system realized the function of generating capacitive power or absorbing inductive power.A new driving and protecting circuit based on FPGA for IPM is designed and it provides the secondary dead-time compensation to ensure the IPM to work safely.

应用现场可编程逻辑阵列器件EPM7032LC44设计了对智能功率模块IPM的驱动和保护电路，通过原理图与VHDL语言相结合的设计方法实现了对IPM的智能性死区补偿，保证了IPM的安全运行和可靠触发。

UENMIS is developed on the basis of the alterability of system, the software engineering theory and the current technology of NMIS system development. It is designed by adopting the method of structural designed, structuring and modularization.

UENMIS系统设计和开发从系统的变更性入手，以软件工程理论和现有的MIS系统开发技术为指导，采用SD方法设计，层次结构法和模块法相结合的开发方法。

Having the characters of flexibility, briskness and good migration, the multi-thread and modularized process structure and transaction execution model meets embedded micro-kernel construction, which is the foundation of the whole system construction.

ARTs-EDB设计的多线索模块化的进程结构和事务执行模型适应嵌入式微内核的结构，它具有灵活、快速和移植性好的特点，是整个系统构建的基础。

A software construction method satisfies Modular Decomposability if it helps in the task of decomposing a software problem into a small number of less complex subproblems, connected by a simple structure, and independent enough to allow further work to proceed separately on each of them

如果一个软件构造方法能把一个软件问题分解成很多较简单的子问题，并把这些子问题用一个简单的架构连接起来，而且能够完全独立的在每一个子问题上再更进一步的分解，那么，这个方法就满足模块的分解性。

This system has been tested on the server, and 210 000 data collected by DUT3000 module validate the system's efficiency and conveniency.

该系统在服务器上试验，通过DUT3000模块采集的21万条数据验证了系统的实效性和便捷性。

And the main module and the database engine all use the general design, has extremely well may Repetition.

并且主要模块及数据库引擎都采用通用设计，具有非常好的可复用性。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

Using the subnet models to establish the flexible logistics automated system which is built and study its logistics process control question. Because of using modular modeling method, the model possesses good extensibility and good transplant ability. Furthermore, the model has self-revisionary ability and include discrete system and continuous system as a result of using self-controlled hybrid Petri-nets modeling method.

由于采用模块化建模的方法，建立的柔性物流自动化系统模型具有扩展性和可移植性好的特点，同时，由于采用自控混合Petri网方法建模，该模型是一个包括离散系统和连续系统的模型并具有在运行过程中进行自我修正的能力。

We investigate the effects of the configurations of the chamber and the coil of an inductively coupled plasma etcher and the process parameters on the homogeneity of plasma distribution.Using the modules of plasma,electromagnetic field,etc.in the commercial software CFD-ACE+,a two-dimensional discharge model of an ICP etcher was built.

为研究感应耦合等离子体刻蚀机腔室与线圈结构以及工艺参数对等离子体分布均匀性的影响，基于商业软件CFD-ACE+中等离子体与电磁场等模块建立了ICP刻蚀机二维放电模型。

Based on the result of experiment, the platform＇s development become facile and expansible.

体现了多模块独立设计思想下中小型短信平台开发的简易性和可扩展性。

Cynanchum Lingtai apricot production in the average weight 65 grams, the brightly-colored fruit, juicy rich, sweet-sour taste, sweet from the nucleolus, when the late Qing Dynasty famous Shaanxi, Gansu provinces, the Qing imperial court Tongzhi tribute for years.

灵台生产的牛心杏平均单果重65克，果实色泽鲜艳，汁多味浓，甜酸适口，离核仁甜，清末时就驰名陕、甘两省，清同治年间曾为朝廷贡品。

Chenopodium album,Solanum nigrum, and Amaranthus retroflexus were very susceptible to the herbicides. Polygonum persicaria and Abutilon theophrasti were relatively less susceptible to the herbicides, and Lycopersicon esculentum was not susceptible to it. The relationship between reduction rates of weed biomass and PPM values of weed leaves 2,4, and 6 days after treatment was established.

供试的6种杂草对该混剂的敏感性存在显著差异：红心藜Chenopodium album、龙葵Solanum nigrum和反枝苋Amaranthus retroflexus对该混剂最敏感，ED90值分别为47.65、71.67和29.17g/hm2；春蓼Polygonum persicaria和苘麻Abutilon theophrasti敏感，ED90值分别为96.91、114.20g/hm2；而番茄不敏感。