查询词典 etching

In order to overcome the wet etching disadvantage and to minimize the additional waste chemical treatment cost, therefore the purpose of this thesis is to study the customization of the batch type plasma dry etcher for power diode process, to analysis the etching mechanism and build up the simulation model for the distribution of plasma power density that will be fitted with the measurement data.

在此前提下，本论文将以客制化的多片式电浆蚀刻机为研究主体，分析其蚀刻机制并建立电浆能量密度的分析模拟模型，并以实验数据做比对，藉此建立模型模拟数据的可信度。

In silicon deep reactive ion etching using inductively coupled plasma etcher,a narrow trench with a width of several micrometers usually shows positively tapered profile, which means that the width of the etched trench decreases with the progress of etching depth.

利用自感应耦合等离子蚀刻机进行硅深层反应离子刻蚀，得到了几微米宽的狭槽，其轮廓通常为正锥形，即蚀刻槽的宽度随着蚀刻深度的增大而减小。

The method can be carried out in a direct plasma etching process or in a remote plasma etching process.

该方法可以在直接等离子体刻蚀处理中或远程等离子体刻蚀处理中执行。

There was a linear relationship between the etching depth and the etching time.

在刻蚀过程中，刻蚀深度和刻蚀时间呈线性关系。

Reactive ion etching, as one of dry etching technologies, was originated in the 1970's.

作为等离子体干法刻蚀技术的一种，反应离子刻蚀诞生于20世纪70年代。

The electroplated ferronickel shutter is suspended by a silicon spring The shutter is fabricated by the nonsilicon surface micromachining techniques. The planar coil is fabricated by high-aspect-ratio photolithography and mask-plating processes. And the silicon spring and the fiber alignment components are fabricated by the reactive ion etching and by the silicon anisotropic etching process.

电镀铁镍制作的挡光片被固定在一个硅弹簧上，该挡光片采用非硅表面微加工工艺制作，平面电感线圈利用高深宽比的光刻工艺和掩蔽电镀工艺制作，硅弹簧和光纤对准元件采用反应离子刻蚀和硅的各向异性腐蚀工艺制作。

Lindsay etching is frontispiece; his last etching used as a book illustration.

林蚀刻是frontispiece ；他最后蚀刻作为一本书的例证。

Etching metal: etching is a kind of chemical process, which means metal legibility created from copy board.

蚀刻金属：蚀刻是一种化学过程，即金属是从副本的板创造的易读性。

Results indicate that etching rates of BST thin films present non-monotonic dependence on mixing ratio of etching gases.

结果表明，刻蚀速率与刻蚀气体的混合比率呈现非单调特性。

Resistance pure water system, 3-waste treatment system, and shock-proof working-table, and about 80 sets of micro-electrical-mechanical technical equipment are installed, including AMS200 ICP plasma etching system, ICP-2B etching machine, AWB04 bonding machine, MA6/BA6 Karlsus double-face photolithography machine/bonding machine, POLI-400 chemical-mechanical-polishing tool, WL2040 aluminum-wire press welder, OPTI CAOT 22i decktop precision spin coasting system, ZSH406 automatic dicing saw system, DQ-500 plasma photoresist-removing machine, HXS150S automatic centrifugal spinner, AXTRON MOCVD metal organic chemical vapor deposit system, 4470 micro-control 4-tube diffusing furnace, type 4371 LPCVD low pressure chemical vapor deposit system, OMICRON MBE molecular beam epitaxy system, JS-3X100B magnet-control spattering equipment, PECVD-2E plasma deposit apparatus, ZZSX500C electron-beam vapor equipment, JC500-3/D magnet-control spattering-coating machine, H63-14/ZM quartz-tube cleaning machine. Measurement instruments include OLS1100 Confocal Laser Scanning Microscope, DEKTAKIII Surface Profiler, D41-11A/ZN 4-probe resistance test instrument, Nikon L150 metallurgical microscope, and so on.

中心现有80多台各种微机电工艺设备，如AMS 200深硅等离子体刻蚀系统、ICP-2B刻蚀机、AWB04键合机、MA6/BA6 Karlsuss双面光刻机和键合机、POLI-400化学机械抛光机、WL2040铝丝压焊机、OPTI CAOT 22i喷涂胶机系统、ZSH406全自动划片机、DQ-500等离子去胶机、全自动清洗甩干机、AXTRON MOCVD金属有机物化学气相沉积系统、4470微控四管扩散炉、4371LPCVD低压化学沉积系统、OMICRON分子束外延系统、JS-3X100B磁控溅射台、PECVD-2E等离子淀积台、ZZSX500C电子束蒸发台、JC500-3/D磁控溅射镀膜机、石英管清洗机，以及多种常用测试仪器，如OLS1100激光共聚焦显微镜、DEKTAK-III台阶测量仪、D41-11A/ZN四探针电阻测试仪、Nikon L150金相显微镜等。

Fostering the concept of multi-culture firmly and mastering the development of advanced culture correctly are conductive to resisting terrorism, separatism of nationalities and ultraism of religion, which is of great academic theoretical, immediate and profound historical si...

牢固树立多元文化的理念和正确把握先进文化的发展方向，有助于在世界范围内自觉地抵制恐怖主义，民族分裂主义和宗教极端主义。不仅具有重大的学术理论意义，而且也具有重大的现实意义和深远的历史意义。

But if anyone walks in the night, he stumbles, because the light is not in him.

11：10 若在黑夜行走，就必碰跌，因为那光不在他里面。