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Our process capability: Plates: FR4, High TG FR4, high CTI FR4, high frequency materials, halogen-free materials, aluminum and other low-rise Materials :2-20 layer of finished copper thickness :0.5-5 OZ finished thickness: 0.2 -6.0mm Minimum line width: 3mil Minimum line spacing: 3mil smallest shape tolerances:+/-0.1mm minimum finished diameter: 0.1mm maximum thickness aperture ratio: 12:1 wide minimum solder bridge: 4mil characters minimum line width: 5mil Minimum height of characters: 30mil Solder Mask Color: Green, black, blue, white, yellow, purple characters such as color: white, yellow, black and other surface processes: spray tin, lead-free HASL, Electroless gold plating Shuijin, OSP, chemical Shen tin, silver and other chemicals Shen Process: Goldfinger, blue gum, Blind-via/Buried-via, characteristic impedance control, rigid-flexible combination of reliability testing such as: Open / Short testing, impedance testing, solderability testing, thermal shock testing, metallographic analysis of micro-slice curvature Isoptera: 0.7% flame retardant Level: 94V-0

我们公司的制程能力:板材:FR4、高TG FR4、高CTI FR4、高频材料、无卤素材料、铝基材料等层数:2-20层成品铜厚:0.5-5 OZ成品板厚:0.2-6.0mm最小线宽:3mil最小线间距:3mil最小外形公差:+/-0.1mm最小成品孔径:0.1mm最大板厚孔径比:12:1最小阻焊桥宽:4mil最小字符线宽:5mil最小字符高度:30mil阻焊颜色:绿色、黑色、蓝色、白色、黄色、紫色等字符颜色:白色、黄色、黑色等表面工艺:喷锡,无铅喷锡、化学沉金、电镀水金、OSP、化学沉锡、化学沉银等其它工艺:金手指、蓝胶、盲埋孔、特性阻抗控制、刚柔结合等可靠性测试:开/短路测试、阻抗测试、可焊性测试、热冲击测试、金相微切片分析等翅曲度:≤0.7%阻燃等级:94V-0

Mainly produces Alpho lead-free welding line, lead-free welding rod, lead-free tin plasma, water-solubility tin plasma, performing tin (for hi-frequency welding), flux, detergent, stainless steel flux, CRC circuit board transparent protection varnish and detergent, KM automatic computer stripper, Yirong PCB leg cutting machine, pin moulding machine, paint remover for enamelled wire, etc.

各种规格爱法锡丝、锡条、锡浆。水溶性锡浆、预成型锡。各种用途爱法助焊剂、清洁剂、不锈钢助焊剂。CRC线路板透明保护漆和清洁剂,KM全自动电脑剥线机,亿荣PCB剪脚机、管脚成型机,漆包线去漆剂等。

Its are main the task is to produce welding flux kind product -- the recipe dissolvent that will come from French flounder and metal (lead - stannic alloy or stannum - silver-colored - copper alloy) mix and become, in order to passes drill rod solder will yuan parts of an apparatus is fixed in printed circuit board on.

其首要任务是出产焊剂类产物——将从法国辗转而来的配方溶剂和金属(铅-锡合金或者锡-银-铜合金)同化而成,用以经由过程钎焊将元器件固定在印刷电路板上。

VRLA battery uses lead calcium alloy for grid and lead tin alloy for strap, the COS process more likes soldering, COS of lead-tin strap is difficult and needs flux and tinning.

VRLA电池使用铅钙合金板栅和铅锡合金汇流排,其制造过程更像是钎焊。铅锡合金汇流排铸焊过程须使用助焊剂和搪锡。

25 Kinds of the weldable Tin and Tin-base alloys electroplating processes in the nearest 10 years in China were rewiewed systematically and completely.

系统而又比较全面地总结了我国近10年来电镀可焊性锡及锡基合金工艺25种,并指出了每种工艺的镀液性能和镀层质量的优劣,最后提出了可焊性电镀的发展趋势。

Since the entire pad on the wafers must be overprinted to achieve an acceptable reflowed bump size, when overprinting is done on tight pad pitches, the apertures must be positioned with enough space between them so that bridging defects do not occur.

因为晶片整个焊盘应过量印刷锡膏以达到课接受的回流峰尺寸。当焊盘锡膏在焊盘斜度过渡印刷时,孔间应有足够的空间,这样才不会产生连锡。

AIM produces all the needed raw materials for it's solder products including powder, mediums and core wire flux.

AIM生产各种焊材产品所需的原材料,包括:锡粉、介质、锡线松香芯和助焊剂。

My company is a company specializing in electronic assembly equipment and service providers, the overwhelming majority of the electronics industry to provide customers screen printing machine, SMT machine, reflow oven, wave soldering, solder paste mixer, solder paste printer, connected to Detect Units, on board machines, under the board machine, a plate feeder Electronics Units SMT production lines, such as the preparation, installation, debugging and so on.

我公司是一家专业电子组装设备及服务提供商,为电子行业的广大客户提供丝印机、贴片机、回流焊炉、波峰焊、锡膏搅拌机、锡膏印刷机、检测接驳台、上板机、下板机、出板接驳台等SMT电子生产线的筹建、安装、调试等。

Ordinary solder materials, lead-free solder, the lead-free solder wire, solder paste, solder, the solder wire , high temperature tin, the low-temperature tin-line, lead-free tin-silver, the lead-free tin-silver line, low-temperature lead-free tin line, welding aluminum tin, the tin-aluminum welding wire, welding wire stainless steel tin, aluminum welding flux not stainless steel flux, environmental flux, welding of stainless steel, nickel, special aluminum solder, aluminum flux, aluminum brazing soft agent, paint remover, paint stripping powder (high-temperature paint stripping enameled wire a few seconds), copper aluminum welding, aluminum and aluminum welding, wire flux of new environmental protection (smoke-free and tasteless, non-volatile non-flammable) peaks of water-soluble flux, no-clean rosin flux, no-clean flux, thinners, cleaning agents, plate washer water , clean water machine, special purposes, such as water-soluble flux.

普通焊锡材料,无铅焊锡条、无铅焊锡线、焊锡膏,焊锡条、焊锡线、高温锡条、低温锡线、无铅含银锡条、无铅含银锡线、无铅低温锡线、焊铝锡条,焊铝锡线、焊不绣钢锡线、焊铝助焊剂、不绣钢助焊剂、环保助焊剂、焊不锈钢、镍、铝特种焊料、铝助焊剂、铝的软钎剂、脱漆剂、脱漆粉、铝铜焊接、铝与铝焊接、环保新型线材助焊剂(无烟无味、不挥发不易燃)水溶性波峰助焊剂、免清洗松香助焊剂、免清洗助焊剂、稀释剂、清洗剂、洗板水、抹机水、特殊用途水溶性助焊剂等。

Since the entire pad on the wafers must be overprinted to achieve an acceptable reflowed bump size, when ov ERP rinting is done on tight pad pitches, the apertures must be positioned with enough space between them so that bridging defects do not occur.

因为晶片整个焊盘应过量印刷锡膏以达到课接受的回流峰尺寸。当焊盘锡膏在焊盘斜度过渡印刷时,孔间应有足够的空间,这样才不会产生连锡。

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