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substrate相关的网络例句

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与 substrate 相关的网络例句 [注:此内容来源于网络,仅供参考]

At first, CoCr、FeNi and Ti layers are deposited with the SPF-312 Sputtering System made by ANELVA and then dependence of microstructure and the magnetic properties on the Ar pressure、power、substrate temperature、bias voltage、film thickness and the distance between the target and substrate are studied systematically.

首先用日本ANELVA生产的SPF—312型磁控溅射装置对CoCr、FeNi、Ti等薄膜的制备工艺进行了探讨,系统地研究了溅射气压、溅射功率、基板温度、基板偏压、膜厚、靶间距等参数对薄膜结构和磁性的影响。

The DLC film deposited at substrate temperature of 100℃ shows the best integrated property with carbon content of sp〓 bonding state up to 40% which is two times more than that in the films prepared by Americans with the same method. Accordingly, the microhardness is up to 30Gpa, and friction coefficient and optical band gap decrease to 0.10 and 1. 76eV respectively. It is found that sp〓C content in DLC films decreases with the increasing substrate temperature in the process of film deposition, especially after 300℃.

当基片温度为100〓C时沉积的DLC薄膜的综合性能最好,此时沉积的DLC薄膜中sp〓C含量最高,达到40%多,是美国学者用同种方法所得结果的2倍;由于薄膜sp〓C的含量高使得其显微硬度达到30GPa,摩擦系数最小为0.10,光学带隙最宽为1.76eV。

Digital color offset printing presses of Indigo than other digital business card printing and membership card making machine with a broader range of substrate (different surfaces and thickness) students'adaptability decorativo business card printing and membership card making paper, card, plastic, or metal substrate.

Indigo的数字彩色胶印机比其他数字制卡和会员卡制作机具有更广范围的承印物适应能力,适于制卡和会员卡制作纸张、卡片、塑料、胶片或金属承印物。

Ink, substrate cannot be completely absorbed in a short time, spreading on the surface of the substrate so that accuracy reduced; little ink, line breaking or even not as fresh as ever and so faoyuan; business card printing stress, largening, innovativeink shear stress liquidity with larger, on the one hand will result in printing ink and spreading, on the other hand, the plate cylinder and nano-imprint lithography imprint area between drum widened from bar code section soim.

不求不朱度不小,承印物不克不及在长工夫边合座汲取,会在承印物暗地铺展,使精度回升;不求不朱度小,线条不颓丧甚至呈现不续划等不本质;制卡压辛过不小,油不朱剪切答辛加不小,流动性也随之变不小,一方背会变成油不朱铺展,另一方背,印版滚筒与压印滚筒间的压印区变宽,也会变成条形码条符变宽。

Spin-coating thin film has many aggregations and pinholes on its surface, TSPP LB films showed a relatively more flattened and condensed surface. The TSPP macrocycle lied vertical to the surface of the substrate, the long alkyl chains of the TSPP were not straight but lay on the substrate with a tilted angle about 52.3°.

在旋转涂得的薄膜上,TSPP分子以聚集体的形式分散分布,未聚集的TSPP分子形成的薄膜表面分布着大量针孔状的缺陷;LB膜表面平整均匀,TSPP分子的环平面紧密地排列在一起以羧基为支撑点垂直&站立&在基片平面上,分子侧链与基片平面成52.3°角排列。

When the operation is the first to be printed on to business card printing and membership card making pattern, and then put the substrate to business card printing and membership card crafted pictorial reference is placed in the appropriate location below, resin; location after transparent paper, in the substrate business card printing and membership card production getfor pattern, so the image can be accurately registration.

不不安息时先在该纸上印上所给制卡和会员卡制息的图案,然后把承印物以制卡和会员卡制息的图案为参照不收在透明纸底下不合的场所;定位后把透明纸折起来,在承印物上制卡和会员卡制息上所给的图案,这样图案不离可以大略不天套准。

The twig production of different clones is different, from 5.5 twigs per month to 14.8 twigs per month. The rooting rate, root number and root length change regularly as the concentration of IBA goes up from 0.05 to 2.00 mg/L. At the concentration of 0.05 mg/L ppm IBA, rooting rate and root length are the highest. Cutting substrate also has eminent effect on rooting rate and survival rate, 50% peat plus 50% sub-top soil is the best substrate. The survival rate differs greatly among clones, from 56.7% to 90.0%. Rooting rate and survival rate change regularly as season changes. The rooting rate of May and June is middle, that of July and August is high and that of September and October drops rapidly. The survival rate is low in May, September and October and high in June, July and August.

结果表明:不同无性系的萌条数量有显著差异,高的达14.8条/月,低的5.5条/月,平均9.1条/月,从0.05~2.00 mg/L,随着IBA浓度的提离,生根率、根条数、总根长等生根指标均呈现有规律的变化;综合考虑各种生根指标,以IBA0.05 mg/L为最佳生根激素处理,扦插介质对柚木插穗生根有显著的影响,以泥炭土+黄心土按1:1混合为最佳扦插介质;不同无性系的扦插成活率不同,从56.7%至90.0%,变动幅度大,随扦插季节变化,生根率和成活率均呈现有规律的变化,5~6月份的生根率中等,7~8月最高,9~10月份迅速下降,成活率随季节的变化也是两头低、中间高,6~8月的成活率最高,大于93%。

A planar-type optical isolator includes a substrate, a first mode splitter, a second mode splitter and a phase shift region formed on the substrate between the first mode splitter and the second mode splitter.

一种平面型光隔离器包括基底,第一模式分离器,第二模式分离器和形成在第一模式分离器和第二模式分离器之间的基底上的相移区。

A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.

然后,利用焊剂填充物来填充所述基板与所述电子组件之间的间隙,并且通过使所述焊点回流来接合所述基板的所述电极端子和所述电子组件的所述电极端子。

The effects of electroplated Ni layer and electroless plated Ni-P layer on the diffusion behavior in Sn-Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni-P layer acted as a good diffusion barrier between Sn-Ag solder and Cu substrate. However, the electroplated Ni layer can not hinder the inter-diffusion and reaction between molten Sn-Ag solder and Cu substrate when reflowing, and there was a layer of IMC (Cu6Sn5) at interface of Sn-Ag/C u solder joint.

摘 要:研究了电镀Ni层和化学镀Ni-P合金层对Sn-Ag/Cu焊点扩散行为的影响,电子探针分析表明:化学镀Ni-P合金层能很好地阻止Sn-Ag/Cu焊点在焊接过程中的Cu,Sn互扩散和相互反应;而电镀Ni层则不能阻止Sn-Ag/Cu焊点在焊接过程中的Cu,Sn互扩散和相互反应,界面反应产物仍以Cu6Sn5为主。

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