查询词典 as thin as a wafer

The invention is directed a patterned contact sheet and to a method of bonding a cover wafer to an interposer wafer using the patterned contact sheet having a waffle-like pattern of a plurality of ridges and plurality of wells to form a cover/interposer combination or unit that can be bonded to a substrate having a MEMs device thereon, the cover wafer, interposer wafer and substrate together forming a protective packaging for the MEMS.

本发明涉及在制造过程中保护临界表面的形成有图案的接触片材以及一种使用形成有图案的接触片材将盖子片粘合到插入物片上以形成盖子/插入物组合或单元的方法，所述接触片材具有华夫饼干状图案的许多脊和许多井，所述盖子/插入物组合或单元可粘合到具有MEM设备的基材上，所述盖子片、插入物片和基材一起形成MEM用的保护性封装。

The device call execute the inputting and taking actions of wafer box, outer rings and inner rings. It can realize the tension controlling during wafer expanding, wafer separating with the metal plate, empty wafer box and waste metal plate discharging.

该装置可完成片盒、内圈和外圈的输入和取片动作，实现扩晶过程张紧力的调节控制、分离晶圆和衬架、排出空片盒和废弃的衬架等。

One is low valence vanadium oxide thin films were deposited by direct current facing target magnetron sputtering firstly, and then thermal oxidated; the other is high valence vanadium oxide thin films were deposited by ion beam sputtering, then thermal deoxidated. Vanadium oxide thin films with phase transition were obtained at the lower thermal process temperature 300℃, which is compatible with MEMS technologys. The composition of VO_x thin film fabricated by first method includes mainly VO_2, V2O3 and VO_, the TCR is -2.25%/K, the TCR gradually increases with phase transition temperature decreases. The composition of VO_x thin film fabricated by the second method includes mainly VO_2, V2O5 and V2O3 , and the resulting VO_x thin filmTCR is -3.0%/K. The TCR of phase transition vanadium oxide thin films made by second method is higher than that made by first method for the existance of V2O5 in thin films.

分别采用直流对靶磁控溅射制备低价态氧化钒薄膜再附加热氧化处理的方式，和射频离子束溅射制备高价氧化钒薄膜附加热还原处理的方式获得了具有相变特性的氧化钒薄膜，第一种方式获得相变特性氧化钒薄膜的热处理温度最低为300℃，克服了以往高温条件下热处理不能与MEMS工艺兼容的缺点；相变特性氧化钒薄膜的组分以VO_2为主，含有V2O3和VO_，室温TCR为-2.25%/K；室温电阻温度系数随相变温度的降低逐渐升高；采用第二种方式获得的相变氧化钒薄膜的组分以VO_2为主，含有V2O5和V2O3，室温TCR可达-3.0%/K；分析发现，具有相变特性的氧化钒薄膜中含有V2O5时，室温电阻温度系数明显增大。

The origin、 development and present state of the container ship2. The deformation characters and collapse mode of the container ship3. The basic theory of thin-walled structural mechanics: The bending of the thin-walled beam; The unconstrained torsion of the thin-walled member bar; The constrained torsion of the thin-walled member bar with opening; The constrained of the thin-walled member bar with closed port.4. The calculation of the warp stress in the container ship based on the thin-walled structural mechanics theoryModeling of the hull ladder calculation based on referred mechanics theories of thin-walled member bar, calculation of crankle character of the each section, such as sectional coordinates、 Free twist shear flow、 secondary shear flow、 bend shear flow and so on.

本文主要包括下述六个方面的内容： 1 集装箱船的起源、发展和现状 2 集装箱船变形特征和破坏形式 3 薄壁结构力学的基本理论◇薄壁梁的弯曲；◇薄壁杆件的自由扭转；◇开口薄壁杆件的约束扭转；◇闭口薄壁杆件的约束扭转 4 利用薄壁结构力学理论计算集装箱船的翘曲应力建立船体阶梯计算模型，利用薄壁杆件力学中相关理论，求解各断面单元的弯扭特性，包括：扇性坐标、自由扭转剪流、二次剪流、弯曲剪流等。

Then, based on the configuration and design principle of the wafer handing robot, the model of the wafer handing robot arm is established. The radial linear concertina motion of the wafer handing robot is analyzed, a type of mechanism that can implement the function is proposed, furthermore, the kinematics of the mechanism is analyzed.

其次，根据硅片传输机器人的构型与设计原则，建立了机器人手臂的模型，对硅片传输机器人的径向直线伸缩运动展开分析，提出了实现该运动的机构，并对机构进行了运动学分析。

Our company relates to optics wafer treating right away starting from the 80's, In the field of wafer treating have accumulated large amount of the special field experience developing、giving birth to a child and managing. Grasp the various optics wafer Flat surface、Spherical surface、Cylindrical surface complete set processing technology.

本公司自八十年代初就开始涉及光学晶片加工，在晶片加工方面积累了大量开发、生产及管理的专业经验，掌握各种光学晶片平面、球面、柱面的全套加工技术。

Now people attach importance to the cleaning of silicon grinded wafer. There are a lot of carborundums and silicon powders on the wafer surface because grinded wafer are grinded by carborundum and corresponding depth are remove in the sequence of grinding. After grinding there are plenty of carborundums and silicon powders enchase in the damaged layers. So there are many difficulties in later processes.

半导体硅单晶衬底加工工业中最受重视是硅磨片的清洗，由于硅磨片是用金刚砂研磨的，研磨过程中又要去除相应的厚度，所以刚加工的磨片表面附着着大量的金刚砂和研磨下来的硅粉，而且还有相当一部分金刚砂和硅粉镶嵌到破损层里面，这给后续的清洗工作带来了困难。

The reactor includes a reaction chamber sized and shaped for receiving the semiconductor wafer and a susceptor having an outer edge and a generally planar wafer receiving surface positioned in the reaction chamber for supporting the semiconductor wafer.

该反应器包括一个反应室，其大小和形状可用来接纳半导体晶片；和一个衬托器，它有一个外边和一个位在反应室内一般为平面的晶片接纳表面可用来支承半导体晶片。

In order to obtain better characteristics of photonic crystal lasers, the wafer bonding technology is introduced to integrate MQWs wafer with different uncompatible wafers. We utilize the direct bonding method and glue bonding method to integrate the 1550nm long-wavelength MQWs with DBR wafer or sapphire. The effect factors of bonding process and choice of bonding materials are discussed. At last, we measure the photoluminescence spectra of our membrane devices and bonding samples.

为了得到更好的光谱特性，我们介绍了各种晶圆接合技术去整合含有多层量子井结构的晶圆与其不相容的材料，我们利用直接接合和溶胶接合的方法去接合1550nm长波长的多层量子井晶圆与含有DBR结构的晶圆或sapphire，并对於各种接合影响因素与材料的选择加以讨论，最后再对我们的层状光子晶体雷射和晶圆接合后的样本做量测。

With the requirement of JiYuan Irish diamond factory, the automatic sorting machine of quartz crystal wafer is studied on by using the international advanced technique of full automatic sorting machine of quartz crystal wafer, which is based on the semi-automatic sorting machine of quartz crystal wafer.

本项目应济源市水晶厂的要求，在原有半自动石英晶片分选机的基础上，借鉴国外全自动石英晶片分选机的先进技术对石英晶片自动分选机进行了研制。

I will not give up and will not call you any more at the same time.

我不会放弃，同时我也不会在给你打电话了。

China is an uneven distribution of resources cross country.

摘要我国是一个资源分布不平横的国家。