compound device

compound device的基本解释

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复合设备

与compound device相关的网络例句 [注：此内容来源于网络，仅供参考]

The main products are: Hammer, thermal conductivity detector, permeameter, contraction of the expansion device, hand-held strain gauge, waterproof material detector, low-bending device, slag ball content in separators, heat load tester, performance test combustion furnace, a variety of thickness, thermal expansion of graphite electrode NG, coal strength meter, electric tamping device, hydrophobicity tester, mineral wool density meter, concrete drilling sampling machines, sawing machines, removed machine, setstube machine, hydraulic bending machine, impervious tester, determination of heat resistance, heating telescopic measuring device, an extension device, penetration tester, small meter, viscometer, drying time tester, pencil hardness tester, pendulum hardness, the adhesion tester, film zoned grid, and resistant to scrubbing detector, solvent resistance detector, wearable device, flat grinding device, wear-resistant coating shakeout device, staining resistance tester, impact tester , piercing instrument, instrument bending film, film coating, and sanding machines, cone-shaped grinding, high-speed dispersion machine, three roller grinder, Scratch tester, indentation tester, gloss Miriam, white tester, fresh video of Miriam, Miriam reflectivity, iron cobalt colorimeter, paint density cup, crack resistance testing apparatus, leveling device, flow hanging device, visual color box, the minimum temperature detector into a grinding, low temperature brittleness tester, visual color boxes, electronic pull machine, Mooney Viscometer, vulcanizing device, the proportion of direct-reading, the cold compression tester, heritage wearable device, Heritage scratch device, the friction coefficient detector, coating Detect zoned grid plate , coating resistance tester, such as burning a variety of test equipment.

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This paper presented the research and exploration of mechanism and technics as well as the design of the magnetic circuit of this new compound machining, based on above, establishing the parameter model, meantime, analyzing influential effects on productivity of magnetic and EDM compound machining the holes through large numbers of experiments, including velcoity contrast experiments of pre-compound and after-compound machining with the change of current, velcoity contrast experiments of pre-compound and after-compound machining with the change of magnetic induction, velcoity contrast experiments of pre-compound and after-compound machining with the change of impulse width, experiments of the superficial roughness, experiments of the Electrode wastage, and intersectant experiments analysis as well as the change experiments of current waveforms. Through a number of experiments we analysed the influential effects of magnetic and EDM compound machining, compared the factors with EDM by oneself. A large of experiment records and deducibility have demonstrated that the productivity of magnetic and EDM compound machining is developed by 20%～400% than traditional EDM.

本论文对磁场电火花复合加工这种新的复合加工的机理、工艺和复合加工的磁路设计进行了研究和探索，在此基础上，建立了磁场电火花复合加工的参数模型，同时通过大量的随着电流变化磁场电火花复合前后加工速度对比实验、磁感应强度变化时的加工速度变化实验、随脉冲宽度变化的加工速度实验、表面粗糙度实验、电极损耗量实验、磁场电火花复合加工正交实验分析、电流波形变化等实验，实验分析了影响磁场电火花小孔加工效率的因素，并且跟单一的电火花加工中的影响因数进行了比较，大量的实验数据和理论推导证明磁场电火花复合加工比传统的单一电火花加工的效率提高了20％～400％左右。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

与compound device相关的网络解释 [注：此内容来源于网络，仅供参考]

compound device：复合设备

因此,可以把多功能的USB设备抽象成如图3的结构(不同类型设备用A和B类设备表示). 总体说来,USB设备有两种基本的设计方法:采用USB复合设备(compound device)的方法和采用USB组合设备(composite device)的方法.

compound device：组合设备

Windows Plus! Extension=使用 Windsows Plus! 扩展视觉样式 | Compound Device=组合设备 | File Based Device=文件基础设备

compound semiconductor device：化合物半导体掐

compound semiconductor body 化合物半导体衬底 | compound semiconductor device 化合物半导体掐 | compound semiconductor interface 化合物半导体界面

compound semiconductor device：化合物半导体装置

2391. compound semiconductor body 化合物半导体衬底 | 2392. compound semiconductor device 化合物半导体装置 | 2393. compound semiconductor interface 化合物半导体界面

compound semiconductor device：化合物半导体掐iVJ中国学习动力网

compound semiconductor body 化合物半导体衬底iVJ中国学习动力网 | compound semiconductor device 化合物半导体掐iVJ中国学习动力网 | compound semiconductor interface 化合物半导体界面iVJ中国学习动力网