阻抗

With the increase of the voltage grade, the pitch number of capacitance bleeder increase accordingly, so that the impact of operation conditions on the capacitance bleeder is also strengthened.

为避免此情况，需选用的CVT电容分压器阻抗比对运行条件不敏感，特别是分压器低压臂阻抗受运行条件的影响要小。

Our process capability: Plates: FR4, High TG FR4, high CTI FR4, high frequency materials, halogen-free materials, aluminum and other low-rise Materials :2-20 layer of finished copper thickness :0.5-5 OZ finished thickness: 0.2 -6.0mm Minimum line width: 3mil Minimum line spacing: 3mil smallest shape tolerances:+/-0.1mm minimum finished diameter: 0.1mm maximum thickness aperture ratio: 12:1 wide minimum solder bridge: 4mil characters minimum line width: 5mil Minimum height of characters: 30mil Solder Mask Color: Green, black, blue, white, yellow, purple characters such as color: white, yellow, black and other surface processes: spray tin, lead-free HASL, Electroless gold plating Shuijin, OSP, chemical Shen tin, silver and other chemicals Shen Process: Goldfinger, blue gum, Blind-via/Buried-via, characteristic impedance control, rigid-flexible combination of reliability testing such as: Open / Short testing, impedance testing, solderability testing, thermal shock testing, metallographic analysis of micro-slice curvature Isoptera: 0.7% flame retardant Level: 94V-0

我们公司的制程能力：板材：FR4、高TG FR4、高CTI FR4、高频材料、无卤素材料、铝基材料等层数：2-20层成品铜厚：0.5-5 OZ成品板厚：0.2-6.0mm最小线宽：3mil最小线间距：3mil最小外形公差：+/-0.1mm最小成品孔径：0.1mm最大板厚孔径比：12：1最小阻焊桥宽：4mil最小字符线宽：5mil最小字符高度：30mil阻焊颜色：绿色、黑色、蓝色、白色、黄色、紫色等字符颜色：白色、黄色、黑色等表面工艺：喷锡，无铅喷锡、化学沉金、电镀水金、OSP、化学沉锡、化学沉银等其它工艺：金手指、蓝胶、盲埋孔、特性阻抗控制、刚柔结合等可靠性测试：开/短路测试、阻抗测试、可焊性测试、热冲击测试、金相微切片分析等翅曲度：≤0.7%阻燃等级：94V-0

The study adopted voltmeter-ammeter method to measure the impedance of fresh and frozen-thawed bluntsnout bream under different frequencies during storage.

运用物理方法-伏安法测定不同频率下冰鲜和解冻团头鲂的阻抗，分析在不同贮藏条件下团头鲂阻抗的相对变化Q值的变化特点。

The results show that in subsynchronous frequencies range the transmission line compensated by the SSSC causes a resonant impedance effect similar to that caused by the fixed capacitors. But the value of the capacitive reactance exhibited by SSSC is smaller than that of the fixed capacitors and the additional resistance component is exhibited by SSSC.

研究表明：次同步频率下串有SSSC支路的阻抗特性与串有等值电容支路的阻抗特性相似，但SSSC所呈现的容抗小于固定电容的容抗，且SSSC还呈现较大的电阻分量。

Different from the conventional Cartesian impedance control schemes which are mostly based on the robot end force/torque information, five joint torque-based schemes in Cartesian/joint space and the stiffness control.

与传统的基于机器人末端力／力矩信息的笛卡尔阻抗控制方案不同，考虑了5种基于关节力矩的笛卡尔阻抗控制方案，包括笛卡尔空间／关节空间基于力的、笛卡尔空间／关节空间基于位置的方案和刚度控制。

Employing FDTD method to calculate the twin strip line characteristic impedance, comparing the result against the microstrip line characteristic impedance .

用FDTD对双带线的特性阻抗进行了计算，并与微带线特性阻抗理论进行比较。

Diode switches or voltage controlled varactors implement dual-band resonators such that they can offer low impedance at the second harmonic of each frequency band, while, in some cases, presenting high impedance at the fundamental frequency as an RF choke circuit.

利用二极体开关或电压控制变容器实施双频共振器以提供在双频操作中每一个频段之二阶谐波的低阻抗，同时在一些实施例里也提供主频段的高阻抗、具有射频阻塞电路作用。

This circuit gives a closed-loop gain equal to the ratio of the sum of R1 and R2 to R1 and a closed-loop 3 dB bandwidth equal to the amplifier unity-gain frequency divided by the closed-loop gain.

和反相电路相比，其最大的不同点在于，其输出信号和输入信号是同相的，其输入阻抗也是相当高的，为 OP 差模输入阻抗与环路增益的乘积(环路增益为：开环增益/闭环增益)。

The results of EIS show that both charge-transferresistance and the diffusion coefficient of lithium ions increases after TiO_2 coating.

交流阻抗的测试结果表明，TiO_2包覆后电荷传递阻抗增加，锂离子的扩散系数增加。

Even the different RFID chip's real part and image part impedance are not the same, we can achieve the best efficiency under complex conjugate matching design concept.

即使RFID晶片的实部或虚部阻抗因厂商有所不同，在匹配阻抗的设计之下也能达到最佳效能。

He is the most remarkable man that I have ever known.

他是我知道的人中最值得注意的人。

Increased appearance of lymphocele was noticed in patients with diabetic nephropathy, congenital malformations of the urinary tract, and inflammatory diseases, including glomerulopathy and extraglomerular ones, after high-voltage radiotherapy and after removal of the renal graft.

经过高压放射疗法和切除移植肾后，在糖尿病肾病患者、泌尿系统先天性畸形患者和炎症患者身上发现淋巴囊肿有所增加，包括肾小球病和球外疾病等。