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I should try the Compak with it, though - does it grind coarsely enough?

我准备用COMPAK试试,然而不知道它能不能研磨的够粗?

Therefore, this structure maintains a consistent rigidity and there is virtually no fiber rod configurational change during the deburring process.

因此,这种结构能够保证去毛刺过程中纤维坚固不变形,保持研磨的一致性

The company has for many years engaged in the pharmaceutical equipment and electrolytic grinding, polishing and grinding experience.

本公司具有多年从事制药设备抛光研磨和电解研磨的经验。

Now people attach importance to the cleaning of silicon grinded wafer. There are a lot of carborundums and silicon powders on the wafer surface because grinded wafer are grinded by carborundum and corresponding depth are remove in the sequence of grinding. After grinding there are plenty of carborundums and silicon powders enchase in the damaged layers. So there are many difficulties in later processes.

半导体硅单晶衬底加工工业中最受重视是硅磨片的清洗,由于硅磨片是用金刚砂研磨的,研磨过程中又要去除相应的厚度,所以刚加工的磨片表面附着着大量的金刚砂和研磨下来的硅粉,而且还有相当一部分金刚砂和硅粉镶嵌到破损层里面,这给后续的清洗工作带来了困难。

The invention provides a method of decreasing big pattern hollow during metal and polysilicon chemical and mechanical rubbing, it mainly uses photoetching and etching technique, combining decorated chemical and mechanical rubbing method, avoids big pattern hollow when metal and polysilicon is rubbed.

本发明提供一种在金属和多晶硅化学机械研磨中减少大图案凹陷的方法,主要通过以光刻和蚀刻技术结合修饰性化学机械研磨的方法,避免对大图案的金属或者多晶硅进行研磨时出现过度凹陷。

The unlifting pressure process in solid abrasive doublesides lapping has been studied through the mathmatics model established in this paper.

针对固着磨料研磨的特点,通过所建立的数学模型,对固着磨料双面研磨过程中压力的变化进行研究,并对研磨过程的压力实施进行优化,从而找到在研磨过程中最佳的施压方法,以达到对硅晶片、玻璃硬盘基片等进行高速精密和超精密加工的目的。

According to the peculiarities of abrading tool, this paper presents the special requirements for making abrasive tool.

研具制造技术是石墨电极研磨技术中的关键的相关技术,它直接关系到研磨的效果。

Pressure count presetting can make control more accurate.

使用了压力预置计数方式控制研磨压力,研磨的圈数,要求可准确控制。

The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like.

本发明提供一种半导体装置的配线形成步骤等中用于研磨的研磨液及研磨方法。

The gas pressure from hard acceleration forces the rings to contact the cylinder around their entire circumference, which is the only way the rings can properly wear into the exact shape of the cylinder to seal the combustion pressure.

这种摩擦力很小且质量不大的部件在消耗能量,里外的压力相差太大,等于单面受压)所以活塞环是无法完全和汽缸壁研磨的,或者说只有很小的一部分在经历研磨的过程。

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