焊点

Mainly described the reflow temperature curve setting up, the solder joint alloy componental calculation and estimation of liquid phase line temperature for backward compatibility assembly.

重点介绍了后向兼容组装中再流温度曲线的设置、焊点合金成分的计算及液相线温度的估算。

Droop lidded 眼皮低垂: 17, But the wild child boldly gets rid of him with a fluid shield and has yielded a building without welds.

但这狂野的小孩勇敢地以一种流体质除去了他，成功地生产了一座无焊点的建筑。

Through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.

通过非线性有限元分析，计算出焊点疲劳寿命对下部填充料基本热力学性质的依赖关系。

The following theoretic analysis shows that structure damages such as external-bounded electrode ungluing and solder joint melting are caused by airflow erosion,centrifugal force and a block temperature of more than 400 ℃ on the nose of the fuze due to the high velocity of the shell.

理论分析说明：由于弹速高，空气阻力使引信头部产生超过400 ℃的阻滞温度，加上气流冲刷和离心力，造成的外贴电极开胶和焊点熔化等结构破坏。

This will occur if the two spot welds are too close together, and it will happen with all metals.

对于所有的金属来说，如果两个焊点在一起距离非常近这钟情况将发生。

The formation of Au-Sn-Ni IMC at solder joint degrades ball shear strength, however, this phenomenon can not be observed in lead free system.

分析表明有两种可能的原因使得无铅产品在焊点附近不能生成金－锡－镍合金。

The finite element analysis model of pre-pressing contact of low carbon steel resistance spot welding un-der spherical electrode condition is created with the finite element software.

1前言电阻点焊是汽车制造领域中的主导加工工艺，每辆汽车上的电阻焊点平均为3000～5000个[1]，因此电阻点焊的质量很大程度上影响着汽车的质量。

In thermal cycling, electrical resistance of solder joints in daisy chain configured assembly was measured. At the same time, a variety of failure analytical tools were employed to inspect the damages in the assembly including solder joint crack, underfill delamination and crack.

在加速试验过程中，测量电参数的同时，利用多种失效分析方法详细研究了封装中的缺陷和损伤，如焊点和下部填充料中的裂缝、以及下部填充料与芯片之间的分层。

The limitations of describing how the nugget growing up in view of single-sensor information source is analyzed in the paper.An idea of using multi-sensor information fusion for spot welding quality control is presented for the first time.

本文分析了基于单一传感器信息资源来描述焊点熔核形成过程存在的局限性，首次提出了采用多传感器信息融合控制点焊质量的思想。

The failure causes are discussed that contamination and scratch of gold plating, non-wetting between gold and solder, lacked bounding protective atmosphere and stress lead to decrement of the die shear strength.

找出了芯片脱落的主要原因：金膜表面污染、划痕、浸润不良、焊接气氛保护不足及应力导致焊点的结合强度不够致使芯片脱落。

The big eared hedgehog, the little owl, the sand gecko, the three-toed jerboa, and every show needs a villain - saw-scale - the viper!

大耳刺猬，小猫头鹰，沙壁虎，三趾跳鼠，每场戏都需要反派角色：蝰蛇。

Plasmodiophora brassicae ; resting spores ; density gradient centrifugation of sucrose ; ultrasonic disruption

根肿；休眠孢子；蔗糖密度梯度离心；超声波破碎