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接合板

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A metal or wooden plate bolted to the sides of two abutting rails or beams, used especially in the laying of railroad track.

接合板,鱼尾板尤指用在铁路枕木上的钉在两个毗连的栏杆或梁木上的金属板或木板

A device used to connect one thing to another.The frames must be butted at the joints.

由拧紧在两个横栏或梁的两边的鱼的接合板造成的对接接头。

Spinal Stabilizer Device Series, Pressure Ball Stanchion Series, Intramedullary Pin, Intramedullary Injector Series, Metal Neck of Femur Series, Metal Orthopedic Objector Series, Metal Neck of Femur Series, Metal Orthopedic Objector Series, Metal Heteromorphy Bone Fracture Plate Products, Common plate, Pins, Injectors Series,"bone bonding implants" and Various Products of Assorted Special Surgical Instruments

脊柱内固定器系列、加压鹅头钉系列、髓内钉、髓内针系列、金属股骨颈钉系列、金属矫形钉系列、金属异形接骨板系列和常用板、钉、针系列等"骨接合植入物",以及各种配套的专用手术器械

At present, the main products of Jinzhou Medical Equipment are: spinal stabilizer device series, pressure ball stanchion series, intramedullary pin, intramedullary injector series, metal neck of femur series, metal orthopedic objector series, metal neck of femur series, metal orthopedic objector series, metal heteromorphy bone fracture plate products, common plate, pins injectors series,"bone bonding implants" and various products of assorted special surgical instruments are with selected material, reliable quality, wide variety and complete specifications.

目前,锦洲医械的主要产品有:脊柱内固定器系列、加压鹅头钉系列、髓内钉、髓内针系列、金属股骨颈钉系列、金属矫形钉系列、金属异形接骨板系列和常用板、钉、针系列等"骨接合植入物",以及各种配套的专用手术器械,选材考究、质量可靠,品种繁多、规格齐全。为适应不断提高的医疗水平,锦洲还开发了多种针对性强、技术性高的新产品;今天,"吉羊"品牌的系列产品已经广泛应用于医疗领域,为千千万万个骨科患者带来了康复的希望!

The plurality of plates include a first plate and a second plate joined to a surface of the first plate.

所述多个板包括第一板和第二板,该第二板接合到第一板的表面。

The research results showed that (1) inelastic compressive behavior of the gusset plate was similar to a cantilever plate in compression load,(2) buckling strength was reasonably predicted based on an inelastic plate buckling equation and buckling coefficient, and (3) design guidelines of the gusset plate in compression were proposed with inclusions of edge stiffeners.

本研究结果显示:(1)含挫屈束制消能斜撑之接合板在受轴压作用下,将产生的挫屈模式为Fixed-Free、(2)接合板在Fixed-Free模式下之挫屈强度预测及(3)如何加劲接合板使其强度能达到降伏后之非弹性挫屈行为。

The research, therefore, aimed to investigate buckling strength and inelastic compressive behavior of the gusset plate with various geometry, edge stiffeners, and boundary conditions. A parametric study was performed by the general purpose nonlinear finite element computer program ABAQUS.

因此本研究将著重在研究钢骨消能斜撑系统之接合板受轴压力下之力学行为,以有限元素分析程式ABAQUS分析含挫屈束制钢骨消能斜撑之一层楼构架之强度及行为,并针对其加劲板进行有限元素分析之参数研究,藉由改变其加劲板的尺寸与后度来探讨对接合板强度之影响。

The arrangement of braces is X type. The braces is H175x175x11x7.5, same as the second test of TCBF. Because of additional knife plates, the braces length in this test is a little shorter than the second TCBF test. The gusset plate design use the UFM instead of ellipse bending design method.

试体高6.66公尺,宽6.7公尺,斜撑排列形式为大X形,斜撑尺寸为H175x175x11x7.5,与第二次TCBF试验采用之斜撑相同,但本研究因需配置额外的连接板而使得斜撑长度略短,接合板则采用规范建议之UFM进行设计,与第二次TCBF椭圆形凹折设计不同。

Help the discussions above is useful for the relative research in the future. From experiment, we found the gussets buckle without stiffeners. After adding stiffeners at the edges of gusset, the buckling of gussets never occurred.

试验过程当中发现斜撑之接合板在未加劲之下会产生挫屈的现象,而在加劲过后挫屈现象便受到有效的控制,分析中发现亦可以缩短斜撑端部与所接梁柱之距离来避免接合板挫屈的发生。

Encapsulant was driven by capillary force into the space between the chip and substrate. Underfill technique can protect the electrical device and prevent the device from destroying because of external force. Underfill has many defects including the fill time is too long, the situation of short shot and air trap are caused easily, the yield of product of Flip-Chip is not highest and the products are universal. Therefore, there are many factors being studied in this paper to sum up the influence of underfill of Flip-Chip process cause by model parameters.

覆晶接合技术为先进电子讯号连接技术中的一种,具有高I/O数、电子讯号路径短以及尺寸小等优点,而采用覆晶接合之电子元件大部分均以底部充填技术进行封装;底部充填是一种以毛细作用为驱动力在晶片与基板之间的间隙充填底胶的封装技术,可以确保晶片不受到外力的影响而损及封装体,但此技术具有充填时间长、容易产生短射与包风等缺点,使得覆晶封装制程良率不高,间接影响覆晶封装产品的普及率,因此本文将依各种可能之参数模型对覆晶封装底部充填制程的影响,以供业界参考。

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