查询词典 wafer bread

Kraft's Oreo efforts have paid off. In 2006, Oreo wafer sticks became the best-selling biscuit in China, outpacing HaoChiDian, a biscuit brand made by Chinese company Dali.

卡 夫食品推广奥利奥的努力最终有所回报。2006年﹐奥利奥威化饼乾成为中国最畅销的饼乾﹐超过了中国本土公司达利旗下的好吃点系列饼乾。

This paper presents several kinds of IC Wafer testing probe card for Semiconductor Packaging and chip test.There are epoxy ring probe、vertical probe card micro spring probe card,and MEMS probe card.

本文简单介绍半导体产业集成电路芯片测试用探针卡，分为以悬臂梁方式的环氧探针、垂直探针和微弹簧丝探针，以及基于微机电系统的MEMS probe card。

The results show that porous YSZ thin films with columnar crystalline structure on NiO/YSZ substrate or in amorphous state on Si wafer were observed.

第二部份则为封装玻璃的合成，选用Pb-与Bi-Zn-Si-B 氧化物玻璃，透过热处理了解其结晶行为与物理特性的变化。

In the production of hynixmodules was used the technology WLP (wafer-level packaging), which consist in the fact that 300- mm of thebase layer is covered with plastic, it will be tested and then onlyit is cut, but it is not packed into the casein the stage subsequent after cutting.

在现代生产模块采用的技术晶圆，其中包括在一个事实，即300 -毫米的基础层是覆盖着塑料，这将是测试，然后才切断，但它是不装的情况后，其后的阶段削减。

In the production of hynixmodules was used the technology WLP (wafer-level packaging), which consist in the fact that 300- mm of thebase layer is covered with plastic, it will be tested and then onlyit is cut, but it is not packed into the casein the stage subsequent after cutting.

在生产Hynix的模块，用技术wlp ，其中包括在事实，即300 -毫米该基地的层所覆盖塑胶，这将是测试，然后只，这是削减，但它是没有装入的情况在第二阶段后，随后的切割。

In the production of hynixmodules was used the technology WLP (wafer-level packaging), which consist in the fact that 300- mm of thebase layer is covered with plastic, it will be tested and then onlyit is cut, but it is not packed into the casein the stage subsequent after cutting.

在生产工艺采用WLP的模块和Hynix其中包含的事实，300毫米的基础上复盖着一层塑料，测试，然后才将它切断，但它并不是在舞台包装成案后，随后切割。

The traditional division between low-end dark-field and high-end bright-field inspection tools can no longer answer inspection needs, especially in high wafer volume capacity manufacturing environments.

传统的检测方法，分别以高感度的明视场检查，与高产能的暗视场检查，无法再满足缺陷检查需求，特别是在大量晶圆产出的环境。

The designed central frequency of the filter is 2017.5MHz and the fractional bandwidth is 0.297%.The filter was fabricated with double-coated DyBa2Cu3O7 film on MgO wafer.

该滤波器的中心频率为2017.5MHz，相对带宽为0.297%，由MgO衬底上的双面DyBa2Cu3O7超导薄膜加工而成。

By means of scanning electron microscope and EDS test, the factors which have a great influence on the ultrasonic wire bonding between the CdZnTe electrode and the Au down-lead are studied, such as surface treatment technology, electrode thickness of CZT wafer and ultrasonic welding parameters.

采用扫描电镜及EDS测试研究了高电阻CdZnTe金电极与外引线的超声焊接工艺，探讨了CdZnTe表面处理工艺、接触电极厚度及焊接参数对引线超声焊接质量的影响规律。

Furthermore, the bonding pressure and welding power have a great effect on the ultrasonic wire bonding rates between the down-lead wire and the CZT contact electrode after the electrode layer preparation technology of CZT wafer is fixed on.

此外，CZT接触电极制备工艺和楔入压力都是影响CZT接触电极与引线超声波焊接质量的主要因素，当CZT接触电极制备工艺确定后，楔入压力成为影响CZT接触电极与引线超声波焊接质量的主要因素，焊接功率则为次要因素。

I can not negligent, he should do what?

我不能不在意了，他要做什么呢？

It is very dangerous to swim in the river alone.

一个人到河里游泳是很危险的。