查询词典 stud breeding

Ifs use finger shape milling cutter or a dish of shape piece of milling cutter adopt single tooth dispart law cutting time, cans process straight teeth, skewed tooth, a garden of stud gear and bring groove double helical gear or worm gear, this moment was processed gear's dentiform then by cutting tool become shape.

若用指形铣刀或盘形片铣刀采用单齿分度法切削时，可加工直齿、斜齿、园柱齿轮及带槽人字齿轮或蜗轮，此时被加工齿轮的齿形则由刀具成形。

In this paper, the main study approaches are quantitative analysis, qualitative analysis, econometric stud

本文所采用的研究方法主要有定量分析、定性分析、数量研究方法以及普遍性和特殊性相结合的方法。

BAL associated with HPLC is an efficient and safe method to stud y the intrapulmonary pharmacokinetics of moxifloxacin in human.

支气管肺泡灌洗结合反相高效液相色谱法研究药物肺内药动学是一种方便、安全、可靠的研究方法。

By leaching experiment in soil columns, the purification and migration characteristics of arsenic in loessial soil were stud-ied.

通过土柱淋滤试验，从动态角度研究了黄土性土壤对砷的净化作用及迁移规律。

With cross-shaped column as the representative of nonrectangnlar columns, one experimental program is conducted to study behavior of slab-column connection with nonrectangular column provided with shear reinforcement, the shear reinforcement include traditional stirrup and stud shear reinforcement .

2以十字形柱为代表，对配置抗冲切钢筋的异形柱－板柱连接的受冲切性能进行了试验研究，将其受冲切特性与文献中相应方柱－板柱连接试验进行了比较分析，研究了抗冲切钢筋对其受冲切特性的影响。

The perturbational reanalysis method of repeated eigenvalues and associated eigenvectors of the lineargeneralized eigenvalue problem is further investigated on the basis of the relevant results of previous stud-ies.

本文基于已有研究结果，进一步探讨了线性广义特征值问题的重特征值及其特征向量摄动重分析理论和方法，阐述了重特征值情形下摄动重分析方法的一些重要特点，完善了重特征值的特征向量的二阶摄动算式，并论证了重特征值摄动法与相异特征值摄动法之间的统一性。

Ranvir and Rajiv are half brothers who own a huge stud farm in South Africa.

户隐响子是东京中央报社的一名记者。

Ranvir and Rajiv are half brothers who own a huge stud farm in South Africa.

超级巨星赛尔·可汗是比鲁小时的同学。

At present stud five cross-linked starch samples were prepared unde different reaction conditions.

目前宝藏5 -交联淀粉样品准备unde不同的反应条件。

On the basis of the summarization of MCM-Cs main features and its assembly and packaging technologies, the paper puts stress on relatively deepgoing studies in practically advanced MCM-C assembly process technologies as gold ball wire bonding, IC chip gold ball stud bump making, IC flip chip bonding and underfilling, in high reliability MCM-C packaging process technologies as integral LTCC substrate packaging, hermetically metal sealing, and also in the basic technological process of MCM-C assembly and packaging. Later on, it presents the effectively engineering development of two high level actual module products--a high-density monolithic processor system MCM-C , a high-speed data collecting and processing system MCM-C. Lastly, it briefly introduces various common methods of quality inspection and reliability test of MCM-C assembly and packaging in engineering practice.

论文在综述MCM-C的主要特点及其组装封装技术的基础上，重点对金丝球引线键合、IC芯片金球凸点制作、IC芯片倒装焊与下填充等实用先进MCM-C组装工艺技术和LTCC基板与外壳及PGA引线的一体化封装、气密性金属封装等高可靠MCM-C封装工艺技术以及MCM-C组装封装基本工艺流程展开了较深入的研究，有效完成了高密度单片机系统MCM-C和高速数据采集控制系统MCM-C等两种高水平实际产品的工程化研制工作，扼要介绍了工程实践中MCM-C组装封装工艺常用的质量检验方法和可靠性试验方法。

It was just a normal day of school

那只是上学的普通一天

Which is a very good reference in this issue.

这是一个在这个问题上很好的参考。