查询词典 layer board

The saltation boundary layer is divided into an inner boundary layer in which the saltating particles exert significant force on the airflow, and an outer boundary layer in which saltating particles exert insignificant force on the airflow, but the out layer is affected by the inner boundary layer.

将风沙边界层划分为跃移颗粒所产生的阻力不可忽略的内边界层和跃移颗粒阻力可以忽略但受内边界层影响的外边界层，分别建立了内边界层和外边界层的风速廓线表达式。

Removable copper shielding layer and semiconductive layer: measure 55mm copper shielding layer with gloved finger end, and peel it off; and then measure 20mm semiconductive layer from the end of copper shielding layer and peel it off.

4剥铜屏蔽层和半导电层：由手套指端量取55mm 铜屏蔽层，其余剥支；从铜屏蔽层端量取20mm 半导电层，其余剥去。

The effects of electroplated Ni layer and electroless plated Ni-P layer on the diffusion behavior in Sn-Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni-P layer acted as a good diffusion barrier between Sn-Ag solder and Cu substrate. However, the electroplated Ni layer can not hinder the inter-diffusion and reaction between molten Sn-Ag solder and Cu substrate when reflowing, and there was a layer of IMC (Cu6Sn5) at interface of Sn-Ag/C u solder joint.

摘 要：研究了电镀Ni层和化学镀Ni-P合金层对Sn-Ag/Cu焊点扩散行为的影响，电子探针分析表明：化学镀Ni-P合金层能很好地阻止Sn-Ag/Cu焊点在焊接过程中的Cu，Sn互扩散和相互反应；而电镀Ni层则不能阻止Sn-Ag/Cu焊点在焊接过程中的Cu，Sn互扩散和相互反应，界面反应产物仍以Cu6Sn5为主。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

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The core board is an 8 layer routed board while the expended board is a 4 layer one.

其中核心板采用8层板布线，扩展板采用4层板布线。

Bonding card board (English name: PLXwood) logs are planed into a 1.6mm-2.0mm between the single board, high temperature drying moisture, up to a certain standard, into the system board workshop preparation chemical raw materials, manufactured according to customer requirements nine, fifteen, eighteen different specifications, such as multi-layer plywood, and then after a high temperature, high pressure, hot pressing machine to suppress made with molded plywood processed into the Pallet is laminated card board.

胶合卡板（英文名字： PLXwood ）是将原木刨成 1.6mm-2.0mm 之间的单板，经高温烘干水份，达到一定标准后，进入制板车间配制化工原料，根据客户要求制成九、十五、十八等不同规格的多层胶合板，再经过高温、高压、热压机压制而成，用成型的胶合板加工成的栈板就是胶合卡板。

As 3 board one part, new 3 board the largest window depended on changing old 3 board " ash-bin " the fixed position of type, inducted numerous hi-tech tall the science and technology that grow medium and small businesses, basically be the place that ZhongGuanCun high-tech enterprise hangs out his shingle at present, of these enterprises join in changed 3 board the adverse situation that one-way rubbish enlarge contains, rose greatly 3 board integral quality and position level.

作为三板的一部分，新三板最大的亮点在于改变了旧三板"垃圾桶"式的定位，吸纳了众多高技术高成长的科技型中小企业，目前主要是中关村高科技企业挂牌的场所，这些企业的加盟改变了三板单向垃圾扩容的不利局面，大大提高了三板整体素质和定位水平。

Remote Control Toys major producers of electronic boards, and voice electronics board such as: remote control cars launch and receive board, mini remote control cars launch and receiver plates, the proportion of remote control cars launch and receiver plate, infrared battle tanks fired and receive board, remote control aircraft diving boat launch and receive board, gyro plate, etc. Our customers can also request for custom design, custom-made a variety of integrated electronic board, but also welcome to sample processing, ordering.

主要生产遥控类玩具的电子板以及语音类电子板如：遥控车发射及接收板，迷你遥控车发射及接收板，比例遥控车发射及接收板，红外对战坦克发射及接收板，遥控飞机潜水艇发射及接收板，陀螺板等等我司也可按客户要求为客户设计，定做各种集成电子板，同时也欢迎来样加工，订货。

The information integrated pattern based on PDM/PLM in the course ofmanufacture is put forward. Under the constraints of building CAPP platform, thearchitecture of CAPP platform is established. The models of decision making andfunction for process planning are given. Then the development means of CAPP basedSmarTeam are extracted.3. The structure of modular product life cycle is established. Toward the divisionand planning of the General Modules oriented product family, theCAD/CAPP integrated model of flexible module based on feature and CAD/CAPPmapping model based on process planning match board are set up. The keytechnologies of Solidworks/SmarTeam/CAPP integration are studies.4. From the point of view of process match board and step match board, theprocess of creating to process planning match board is studied. As an example, themachining process planning of up beam of hydraulic press machines is used tointroduce the establishment of process planning match board by means of inferencebased on expert knowledge. The organize model about the process planning matchboard oriented product family is brought forward.5. The multi-decision methods of CAPP system based on analytic hierarchy aregiven.. On the basis of uniform data model, the sub-machining process planning ofpart is auto-created by means of analytic hierarchy, The step decision methods basedon AHP is put forward.6. For the design/manufacture information in the course of product life cycle, thetree structure based on Object-Oriented and static model based UML are founded. Themethod of establishing design/manufacture information management system isbrought forward. The commercial PLM software—SmarTeam is regarded asdevelopment platform, on basis of which, the design/manufacture informationmanagement system is built, and the multi-view mapping technique ofdesign/manufacture information model is studies.7. A computer-aided CAPP platform based on PDM/PLM is founded, and itsstructure, function, work flow is illustrated. Some example of the system areintroduced.

阐述课题提出的目的和意义，明确了本文研究的主要内容。2、提出基于PDM/PLM的制造过程信息化集成模式；在平台式CAPP系统的设计约束模型基础上，构建了平台式CAPP系统的体系结构；并给出工艺决策模型和功能模型；最后提出基于SmarTeam的CAPP开发模式和实现策略。3、建立模块化产品生命周期模型的组织结构；针对面向产品族的广义模块的划分和规划方法，建立基于特征的柔性模块CAD/CAPP集成模型及基于工艺模板的CAD/CAPP映射模型；研究Solidworks/SmarTeam/CAPP集成的关键技术。4、从工序模板和工步模板的角度研究了工艺模板的创建过程；以液压机上梁模块机加工为例，采用基于专家知识的推理技术实现了工艺模板的创成；提出了面向产品族的工艺模板分层结构树的组织模式。5、提出基于分层规划的多模式工艺决策流程；在统一数据模型的基础上，从特征层和零件层分层规划，实现了零件加工子工艺的自动创成；提出基于AHP的工步排序决策方法。6、针对产品生命周期中的设计/制造信息，建立了面向对象的类树结构和基于UML的静态结构模型；提出基于PDM/PLM软件的设计/制造信息管理系统的构建方法；以商品化PLM软件SmarTeam作为开发平台，开发了基于SmarTeam的设计/制造信息管理原型系统；研究设计/制造信息模型多视图映射机制。7、开发了基于PDM/PLM的平台式CAPP原型系统，构建了系统的功能模型，并对系统的主要功能进行说明，给出系统的运行实例。

Because the strength of springwood was very low, the strength of board which included more springwood was low. The main reason why there was no difference in wet compressing shear strength between quarter-sawn board and flat-sawn board was that quarter-sawn board had a lot of pits on radial cell wall and in flat-sawn board xylary rays were transversely cut and left a lot of pores which provided a kind of tunnels for water.

造成柞木径切板的反复煮沸压缩剪切强度与弦切板的反复煮沸压缩剪切强度没有显著性差别的主要原因是柞木细胞壁径面上的纹孔很多，而弦面上的木射线在经刨削后是横断的，留下许多孔隙，这使得弦径向均有成为水分通道的孔隙，造成柞木径切板的反复煮沸压缩剪切强度与弦切板没有显著性差别。

The quality of both red and white wine depends very much on the wine maker talent and on the quality of the grapes.

他的红酒和白酒的品质，根据酿造者的能力和葡萄的质量，各有差异。

No, I don't want to get drunk before my next match.

" "不，我不想让我的下一场比赛前喝醉了。