查询词典 dicing

The Christmas getaway is normally one of the busiest times of the year, but the millions hoping to hit the road today are being warned: You'd be dicing with death.

圣诞节出行通常是每年交通最繁忙的时候，但是今年打算出行的人们接到的警告却是：你们这是拿性命在开玩笑。

Dicing the city government to send liaison officers to attend community meetings to provide information to the community.

划片市政府派出联络官，参加社区会议，以提供资讯给社会。

Julienne can be fashioned into classic brunoise by simply dicing julienne logs into 1/8 cubes.

朱利安可以形成成经典 brunoise 简单地划片朱利安原木到1 / 8 立方体。

Resistance pure water system, 3-waste treatment system, and shock-proof working-table, and about 80 sets of micro-electrical-mechanical technical equipment are installed, including AMS200 ICP plasma etching system, ICP-2B etching machine, AWB04 bonding machine, MA6/BA6 Karlsus double-face photolithography machine/bonding machine, POLI-400 chemical-mechanical-polishing tool, WL2040 aluminum-wire press welder, OPTI CAOT 22i decktop precision spin coasting system, ZSH406 automatic dicing saw system, DQ-500 plasma photoresist-removing machine, HXS150S automatic centrifugal spinner, AXTRON MOCVD metal organic chemical vapor deposit system, 4470 micro-control 4-tube diffusing furnace, type 4371 LPCVD low pressure chemical vapor deposit system, OMICRON MBE molecular beam epitaxy system, JS-3X100B magnet-control spattering equipment, PECVD-2E plasma deposit apparatus, ZZSX500C electron-beam vapor equipment, JC500-3/D magnet-control spattering-coating machine, H63-14/ZM quartz-tube cleaning machine. Measurement instruments include OLS1100 Confocal Laser Scanning Microscope, DEKTAKIII Surface Profiler, D41-11A/ZN 4-probe resistance test instrument, Nikon L150 metallurgical microscope, and so on.

中心现有80多台各种微机电工艺设备，如AMS 200深硅等离子体刻蚀系统、ICP-2B刻蚀机、AWB04键合机、MA6/BA6 Karlsuss双面光刻机和键合机、POLI-400化学机械抛光机、WL2040铝丝压焊机、OPTI CAOT 22i喷涂胶机系统、ZSH406全自动划片机、DQ-500等离子去胶机、全自动清洗甩干机、AXTRON MOCVD金属有机物化学气相沉积系统、4470微控四管扩散炉、4371LPCVD低压化学沉积系统、OMICRON分子束外延系统、JS-3X100B磁控溅射台、PECVD-2E等离子淀积台、ZZSX500C电子束蒸发台、JC500-3/D磁控溅射镀膜机、石英管清洗机，以及多种常用测试仪器，如OLS1100激光共聚焦显微镜、DEKTAK-III台阶测量仪、D41-11A/ZN四探针电阻测试仪、Nikon L150金相显微镜等。

In other words, some Wall Street rocket scientist in charge of slicing and dicing subprime mortgages could make $5 million as long as he or she was far enough down the corporate ladder.

银行们仍然可以给他们的 CEO 巨额奖金，只不过奖金需要以受限制的股票形式，即只有还清所有纳税人的援助后，股票才可以套现。

For several years now, technology leading compound semiconductor companies have introduced multi beam laser dicing to replace the conversional mechanical die separation technology such as sawing and scribe and break.

已有几年了，技术领先的复合半导体公司引进了多光束激光划片来替代常规的机械式冲模分离技术，比如锯开，划线器划开然后掰开。

The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

该方法包括以下步骤：在硅衬底上形成可剥离树脂层；在所述可剥离树脂层上形成布线衬底；将半导体芯片安装在所述布线衬底上；通过用密封树脂密封所述多个半导体芯片来形成半导体器件；通过从密封树脂侧将这些半导体器件切分但是保留硅衬底来使这些半导体器件个体化；将每个个体化半导体器件在所述硅衬底和可剥离树脂层之间从硅衬底上剥离；并且通过形成穿过可剥离树脂层的孔或者通过除去可剥离树脂层来使布线衬底上的端子暴露。

And then, this article makes full illustration of the RP technology and study on intomb messages describing, fault-tolerance dicing, the Laminated Object Manufacturing which is applied greatly according to the characteristics of CAS development. On the base of author's own scientific research work, this article gives a typical developing mode for new motorcycle products, discusses the trend towards integration of RP technology and the application of the RE/RP-based Rapid Mould Manufacture, especially the cooperative mechanism of infuse plastic product rapid manufacture and the development trend of RT technology as well as the developing policy to that.

根据CAS产品开发的特点，对RP技术作了全面的论述，研究了RP制造中实体信息描述与容错切片，对应用范围较广的叠层实体制造工艺的工艺过程作了详细的研究，并结合作者的科研工作，提出了一种典型的摩托车新品的开发模式，讨论了RP技术的集成化发展趋势和基于RE／RP技术的快速模具制造技术的应用特别是注塑产品快速制造的协同机制。

The dicing kerfs have been reduced to below 20 um in many cases, with no chipping on either front or backside.

在很多情况下，刻划宽度可以小到20um，上下都没有碎屑。

You know, all these washing chopping, slicing,dicing and always these cabbages, Chinese leaves, carrots celery, lccks, Eggplants, cauliflowers spinaches,cucumbers,peanuts,lotus roots ...

马马虎虎。你知道的啊，所有的这些洗，剁，切，切块工作，还有那些卷白菜，生菜叶，胡萝卜，芹菜，lccks，茄子，花椰菜，菠菜，黄瓜，花生，莲藕。。。

Further more, the simplified analysis method on stressed-skin effect of corrugated steel sheet is also discussed in detail.

此外还比较详细地探讨了蒙皮效应的简化分析方法。

If I had known her telephone number,I would have called her.

要是我知道她的电话号码，我就打电话给她了。