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aperture ratio相关的网络例句

查询词典 aperture ratio

与 aperture ratio 相关的网络例句 [注:此内容来源于网络,仅供参考]

Owing to many advantages, such as high aperture ratio, high resolution, low cost and low power consumption, LCOS display becomes a...

LCOS技术以高开口率、高分辨率、低价格和低能耗等优点成为近些年最具发展潜力的显示技术。

At present, more than 200 employees, has production capacity of laminates 30, 1:13 aperture ratio to achieve the highest and second-order with the production of HDI technology; and thick, thick copper, mix board, the board high-frequency, high TG board , High-precision impedance board has a wealth of experience in production.

目前公司员工200余人,已具备生产30层板的能力,孔径比最高做到1:13,并具备生产HDI二阶技术;并对厚板、厚铜板、混压板、高频板、高TG板、高精度阻抗板有丰富的生产经验。

The relation between the spectrographic aperture ratio and elliptical eccentricity, spectral angle is also analyzed according to the elliptical geometry, it will decrease when the x-ray wavelength increases.

根据椭圆的几何关系,研究了光谱相对孔径与椭圆的离心率和谱线探测角之间的关系,它随X射线波长增大而减小。

He Cross-Talk problem of big capacity IPSLCD is same to TNLCD, the TFT method is a effective way to solve this problem, but the design of electrode and store capacity affected the aperture ratio and threshold voltage.

FT-IPS电极设计和存储电容设计对于器件的驱动电压和开口率有很大影响,本文从降低器件的驱动电压和扩大开口率的角度出发,对TFT-IPS电极设计进行优化设计,并设计了新型存储电容,使得开口率提高了22%。

Measures such as area ratio (the area under the aperture opening divided by the surface area of the aperture wall) and aspect ratio (aperture width divided by stencil thickness) can be used to determine appropriate aperture sizes.

因此,严格控制孔的质量是钢网成功设计的关键。特别是小量沉积材料要求精度高时的高精度要求。

The quasi-static compression tests were performed to analyze the effects of facing paper,aperture ratio,and thickness on the loading capacity of honeycomb paperboard.

对蜂窝纸芯和纸板准静态压缩实验,测定分析面纸、孔径比、厚度对蜂窝承载性能的影响。

An organic EL display panel having display pixels with an improved aperture ratio.

提供了一种含有改良孔径比的显示像素的有机EL显示板。

It not only can increase the aperture ratio, but it also can decrease the time of charge as well as can accelerate the speed of setting the pixel.

在新型的画素电路方面,是提出新式电流型的画素电路,主要是改善传统电路中储存电容过大,造成开口率过低的问题,新型画素电路可将储存电容有效的缩小,不仅可增加开口率,且能减少充电时间,加速画素设定时间,适合应用於大画面、高解析度的面板。

Our process capability: Plates: FR4, High TG FR4, high CTI FR4, high frequency materials, halogen-free materials, aluminum and other low-rise Materials :2-20 layer of finished copper thickness :0.5-5 OZ finished thickness: 0.2 -6.0mm Minimum line width: 3mil Minimum line spacing: 3mil smallest shape tolerances:+/-0.1mm minimum finished diameter: 0.1mm maximum thickness aperture ratio: 12:1 wide minimum solder bridge: 4mil characters minimum line width: 5mil Minimum height of characters: 30mil Solder Mask Color: Green, black, blue, white, yellow, purple characters such as color: white, yellow, black and other surface processes: spray tin, lead-free HASL, Electroless gold plating Shuijin, OSP, chemical Shen tin, silver and other chemicals Shen Process: Goldfinger, blue gum, Blind-via/Buried-via, characteristic impedance control, rigid-flexible combination of reliability testing such as: Open / Short testing, impedance testing, solderability testing, thermal shock testing, metallographic analysis of micro-slice curvature Isoptera: 0.7% flame retardant Level: 94V-0

我们公司的制程能力:板材:FR4、高TG FR4、高CTI FR4、高频材料、无卤素材料、铝基材料等层数:2-20层成品铜厚:0.5-5 OZ成品板厚:0.2-6.0mm最小线宽:3mil最小线间距:3mil最小外形公差:+/-0.1mm最小成品孔径:0.1mm最大板厚孔径比:12:1最小阻焊桥宽:4mil最小字符线宽:5mil最小字符高度:30mil阻焊颜色:绿色、黑色、蓝色、白色、黄色、紫色等字符颜色:白色、黄色、黑色等表面工艺:喷锡,无铅喷锡、化学沉金、电镀水金、OSP、化学沉锡、化学沉银等其它工艺:金手指、蓝胶、盲埋孔、特性阻抗控制、刚柔结合等可靠性测试:开/短路测试、阻抗测试、可焊性测试、热冲击测试、金相微切片分析等翅曲度:≤0.7%阻燃等级:94V-0

However, with the current breakthrough utilizing HAST (Hyper-amorphous silicon TFT) technology, Casio has managed to reduce the dot pitch (from typical 23um to 15.5um) while still able to maintain the perfect light aperture ratio.

然而,目前的突破,利用你技术,卡西欧已经设法减少点距(从典型23um到15.5um ),而仍然能够保持完美的光孔径比。

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