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M. S.相关的网络例句

查询词典 M. S.

与 M. S. 相关的网络例句 [注:此内容来源于网络,仅供参考]

In this paper, an M/M/S/N queuing system with balking, reneging and multiple synchronous vacations is studied.

研究了带有止步和中途退出的M/M/S/N同步多重休假的排队系统。

74HC14N652 Pinout:· M/S = H for BUSY output flag on Master M/S = L for BUSY input on Slave · Busy and Interrupt Flags · Devices are capable of withstanding greater than 2001V electrostatic charge.

74HC14N652引脚说明:·M的上主M / S的忙输出标志= 1 / S的=对奴隶的H·闲和中断标志·设备繁忙输入可承受大于2001V静电荷的能力。

SAK-C167CR-LM easily expands data bus width to 32 bits or more using the Master/Slave select when cascading more than one device M/S = VIH for BUSY output flag on Master M/S = VIL for BUSY input on Slave BUSY and Interrupt Flag On-chip port arbitration logic Full on-chip hardware support of semaphore signaling between ports Fully asynchronous operation from either port LVTTL-compatible, single 3.3V (0.3V) power supply Available in 84-pin PGA, 84-pin PLCC and 100-pin TQFP Industrial temperature range (-40C to +85C) is available for selected speeds

朔C167CR - LM滚动轻松扩展数据总线的宽度为32位或更多的使用主/从选择当级联多个器件M / S的=关于硕士M / S的=忙输出标志VIH VIL数值就投入繁忙和忙碌的奴隶中断标志片全部港口的仲裁逻辑芯片上的信号灯的信号港口之间的异步操作完全由硬件支持任何港口的LVTTL兼容,(为0.3V)电源可在84引脚PGA的,84引脚PLCC和单3.3V 100引脚TQFP工业温度范围(- 40C至+85 C)是选定的速度可

MBRD1035CTLT4G easily expands data bus width to 32 bits or more using the Master/Slave select when cascading more than one device M/S = VIH for BUSY output flag on Master M/S = VIL for BUSY input on Slave BUSY and Interrupt Flag On-chip port arbitration logic Full on-chip hardware support of semaphore signaling between ports Fully asynchronous operation from either port LVTTL-compatible, single 3.3V (0.3V) power supply Available in 84-pin PGA, 84-pin PLCC and 100-pin TQFP Industrial temperature range (-40C to +85C) is available for selected speeds

1第1页,本页显示记录1-11,共11条记录分1页显示MBRD1035CTLT4G轻松扩展数据总线的宽度为32位或更多的使用主/从选择当级联多个器件M / S的= VIH对奴隶繁忙投入繁忙和中断标志对主M / S的= VIL数值忙输出标志上港口全部仲裁逻辑芯片的片上信号信号港口之间的异步操作完全由硬件支持任何港口的LVTTL兼容,(为0.3V)电源可在84引脚PGA巡回赛,84引脚PLCC和100引脚TQFP封装3.3V单工业温度范围(- 40C至+85 C)是选定的速度可

By the cooling curve and the temperature field, it can he known that, the solidification time of ribbon is 1.0×10^(-4)s, the even solidification rate of ribbon with 60 μm thickness is about 10^6K/s, and the temperature of cooling process does not obviously go back by the release of solidification latent heat. The solidification rate of ribbon is at 0.010-0.394 m/s, and it changes from high to low with the prolonged solidification time.

由冷却曲线和温度场曲线类比结果可知,带子的凝固时间为1.0×10^(-4)s;单辊快淬的平均冷却速度在10^6 K/s数量级,且凝固潜热的释放不会明显地引起冷却过程的温度回升;带子的凝固速度在0.010~0.394 m/s范围之内随凝固时间的延长逐渐由大变小。

In terns of the general theory of linear algebra, reduced matrix for the operator M are similar to a Jordan matrix J, namely M = S~lJS .

当约化矩阵M不可对角化时,根据线形代数的一般理论,这时约化矩阵M与一个约当矩阵J相似,即M=S~(-1)JS,其中S是关于k,q_0的任意可逆矩阵。

The maximum error of regional anomaly separation is 3.101×10^(-6)m/s^2 the mean square error is 0.989×10^(-6)m/s^2 and the maximum percentage error is 7.76% for several data on the boundary and is lower than 4.1% for the other points.

分离出的区域异常最大误差为3.101×10^(-6)m/s^2,均方差为0.989×10^(-6)m/s^2,最大百分比误差仅在边部的几个数据上,为7.76%,其余各点的误差均小于4.1%。

The fabrication of transmission gratings with the grating constant of 2.5μm and 5μm is studied in ZK6 and LaF2 glasses at the machining speed of 400μm/s by using femtoscond laser with the peak intensity of 2.7×10~(13)W/cm~2, and the diffraction patterns of the grating are presented with a semiconductors laser at 650 nm.

在加工速度为400μm/s、激光的峰值功率密度为2.7×10~(13)W/cm~2时,在ZK6玻璃和LaF2玻璃内制备出光栅常数为2.5μm和5μm的透射式衍射光栅,并在650nm的半导体激光照射下获得了光栅的衍射图样。

The results show that the turbulence intensity, fouling cleaning intensity and pressure drop increase with the increase of flow velocity, particle size and the volume fraction. The effect of liquid-solid fluidzed-bed cleaning fouling depends on the reasonable combination of flow velocity, particle size and the volume fraction. Through an integral consideration of water saving and energy saving and uniformity of fouling cleaning, the optimum flow velocity of flow, particle size and volume fraction are 2.0 m/s~2.5 m/s, 3 mm~4 mm and of 5%~8 vol%, respectively.

结果表明:流体的湍流强度、壁面污垢清洗强度和压力降均随流速、颗粒粒径和体积分数的增加而增加;液固流态化清洗防垢除垢效果取决于流速、液固颗粒粒径和体积分数的合理组合;综合考虑节水节能及污垢清洗的均匀性,高炉冷却壁的最佳流速为2.0~2.5 m/s,固相颗粒粒径为3~4 mm,体积分数为5%~8%。

The r.m.s. deviations of bond length are 0.0016 nm and 0.0014 nm, the r.m.s.

键长的r.m.s。偏差分别为0.0016nm和0.0014nm,键角的r.m.s。

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