查询词典 CPU memory

Direct memory access, DMA, is a method used to bypass the CPU in these transfers, thus performing them much more quickly.

直接存储器访问就是在数据传输中绕过CPU的一种方法，因此执行起来速度很快。

The enhanced direct memory access is an important technology used for fast speed data transfer in data signal processor.EDMA is able to move data block independent of CPU, and this capability meets real-time image processing.

增强型直接内存存取是数字信号处理器中用于快速数据交换的重要技术，具有独立于CPU 的后台批量数据传输的能力，能够满足实时图像处理中高速数据传输的要求。

From here is main board, CPU, memory, display card, external storage and power supply.

依次是主板，中央处理器，内存，显卡，外部存储器，和电源。

The essential hardwares of computer contain CPU, memory, interrupt controller, DMA controller, etc.

计算机硬件的核心器件有 CPU、内存、中断控制器、DMA 控制器，等等。

DMA technology is another similar kind of mechanism that can perform the memory transfer without the CPU assistance.

的DMA技术，是另一个类似的机制，可以执行的记忆不转让的CPU援助。

Follow value in Dump - follows contents of doubleword memory pointed to by selected address in Dump pane of CPU window.

在Dump面板跟进值-根据所选地址在CPU窗口的Dump面板显示双字的内存指针跟进内容。

A performance monitor displays a dynamic overview of CPU and memory usage.

性能监视器显示有活力的 CPU 和记忆使用的概述。

In Chapter 4, on the basis of the selected CPU chips, the hardware frame of the embroidery machine control system is determined according to the overall framework. The power circuit, reset circuit, memory interface circuit, keyboard and display circuit, USB interface circuit, serial communication interface circuit and nether electromechanical interface circuit are designed in particular.

第四章根据总体架构，在选好的CPU芯片的基础上确定了绣花机控制系统的硬件框架，详细设计了电源电路、复位电路、存储器接口电路、键盘与显示电路、USB接口电路、串行通信接口电路和下层机电接口电路。

One is the CPU, and the other is EMS memory.

一个是中央处理器，一个是内存。

TSV has been in large shipment in image sensor and MEMS field, and it will rapidly expand to memory field in the future, and to DSP, RF IC, cell phone baseband, processor, CPU and GPU in 2013. Furthermore, TSV market size will rise to over US$2 billion from less than US$ 300 million currently, which will be the rapidest growing field in semiconductor industry.

在图像传感器、MEMS领域TSV已经大量出货，未来将快速扩展到内存领域，2013年会扩展到DSP、射频IC、手机基频、应用处理器、CPU和GPU领域。2013年，TSV市场规模将从目前的不足3亿美元扩展到20亿美元以上，是半导体产业发展速度最快的领域。

Don not attempt to do something which you can not to do.

不要企图做那些办不到的事情。

The expression of CTGF and TNF-αweredetected by immunochemistry and the number of Clara Cells was calculated.

光镜下观察肺组织的病理变化，采用免疫组化染色观察肺组织中结缔组织生长因子和肿瘤坏死因子-α的表达和Clara细胞的数量。