- 更多网络例句与无焊料的相关的网络例句 [注：此内容来源于网络，仅供参考]
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Under temperature cycling conditions, this Pb-rich phase tends to coarsen and eventually leads to solder joint cracking.
因此，通过合理化设计的无铅锡基焊料由于消除了富铅相的影响，提高了焊料的机械性能，从而强化了焊点。
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Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes.
无汞的平面日光灯中焊料中的铅（如用于液晶显示器，设计或工业照明
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Besides, the company has developed a series of high quality leadless tin solders and fluxes.
本公司借鉴欧盟标准，根据国际标准组织(用于焊料合金中含铅量应低于0.1%)的规定，研制出了一系列高品质的无铅焊锡产品及无铅焊料助剂。
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In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip -solderng.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
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Improving producibility of PCBA includes much factors, such as fabrication of PCB ,design of component, selection of solder, capability of equipment and technology of process.
摘 要：在无铅条件下提高PCBA可制造性涉及的因素包括： PCB 和元器件的制造、焊料的选用、设备的加工能力以及工艺技术等。
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To suit the thought of international electronic environment protection ,we develop the lead free and green electronic assembly project at first , and yield a product in first suitable lead free soldering GS series reflower and WS-350PC series wave soldering system, help many enterprises realize lead free process improvement in the same time, and gained a good reputation and remarkable achievement.
公司针对国际电子行业环保概念的兴起，引入了无铅焊料和绿色电子组装的全新课题，率先开发出适合无铅焊接的GS系列热风回流焊锡机和WS-350PC系列波峰焊锡机，成功帮助了众多企业实现无铅制程工艺的改良，同时也为公司赢得了很高的声誉。
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One of the main objectives of this study is to develop a generic thermo-mechanical durability model for Pb-free solders.
这项研究的主要目标之一是建立一个通用的热机械为无铅焊料的耐久性模型。
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In the process of Lead-free, because of the difference of lead-free solders and adjustment of technical parameter, we will face many new problems of reliability.
在无铅化进程中，由于无铅焊点焊料的不同和焊接工艺参数的调整，必然会给焊点可靠性带来许多新的影响。
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It is urgent to realize mechanicalcharacterization and constitutive properties of lead-free solders.
因此，迫切需要准确理解无铅焊料的力学响应和本构行为。
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Ordinary solder materials, lead-free solder, the lead-free solder wire, solder paste, solder, the solder wire , high temperature tin, the low-temperature tin-line, lead-free tin-silver, the lead-free tin-silver line, low-temperature lead-free tin line, welding aluminum tin, the tin-aluminum welding wire, welding wire stainless steel tin, aluminum welding flux not stainless steel flux, environmental flux, welding of stainless steel, nickel, special aluminum solder, aluminum flux, aluminum brazing soft agent, paint remover, paint stripping powder (high-temperature paint stripping enameled wire a few seconds), copper aluminum welding, aluminum and aluminum welding, wire flux of new environmental protection (smoke-free and tasteless, non-volatile non-flammable) peaks of water-soluble flux, no-clean rosin flux, no-clean flux, thinners, cleaning agents, plate washer water , clean water machine, special purposes, such as water-soluble flux.
普通焊锡材料，无铅焊锡条、无铅焊锡线、焊锡膏，焊锡条、焊锡线、高温锡条、低温锡线、无铅含银锡条、无铅含银锡线、无铅低温锡线、焊铝锡条，焊铝锡线、焊不绣钢锡线、焊铝助焊剂、不绣钢助焊剂、环保助焊剂、焊不锈钢、镍、铝特种焊料、铝助焊剂、铝的软钎剂、脱漆剂、脱漆粉、铝铜焊接、铝与铝焊接、环保新型线材助焊剂(无烟无味、不挥发不易燃)水溶性波峰助焊剂、免清洗松香助焊剂、免清洗助焊剂、稀释剂、清洗剂、洗板水、抹机水、特殊用途水溶性助焊剂等。
- 更多网络解释与无焊料的相关的网络解释 [注：此内容来源于网络，仅供参考]
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bi：铋
较接近Sn-37Pb,中温系3、金箭焊料有限公司无铅焊料成份的筛选:筛选依据见本文(三),为达目标选择种类以Sn-Cu系Sn-Ag系为基础,供选择的添加元素如下:●熔点降低类:铟(In)铋(Bi)●抗氧化类:镓(G
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Ce：铈
中温系3、金箭焊料有限公司无铅焊料成份的筛选:筛选依据见本文(三),为达目标选择种类以Sn-Cu系Sn-Ag系为基础,供选择的添加元素如下:●熔点降低类:铟(In)铋(Bi)●抗氧化类:镓(Ga)铟(In)磷(P)●改善组织结构类:锗(Ge)铈(Ce)(请参考以下示意图
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segregation：偏析
另外,由于没有使用以往无铅焊锡有时会使用到的铋,所以不易产生变硬变脆的偏析(Segregation)现象, 因此在回流焊接无铅焊锡以外也可得到广泛应用. 2.无铅工艺的控制. 人们采用更昂贵的焊料,自然是期望焊接缺陷更少.
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soft solder：软焊料
软焊料( soft solder) 一般按材料分: 有铅,无铅 按材料熔点温度分: 高温(含铅的一般熔点较高在280度左右),低温(Sn Ti Ag等) 欧洲已制定含铅生产需环保回收,由于成本较高,因此大多已移至亚洲等中等发达地区生产,软焊料在国内市场最近5年内,
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solderless：无焊料的
soldering 锡焊 | solderless 无焊料的 | soldier 战士;木片;竖桩