chip budding

chip budding的基本解释

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嵌木芽接

与chip budding相关的网络例句 [注：此内容来源于网络，仅供参考]

The future development trend is except high-end DTVs with more than 37 inches in size, the other sizes of TV will all adopt highly integrated single chip design, which integrates signal demodulator chip, video-control chip, MPEG-2 decode chip, video processing chip, HDMI interface chip and audio frequency processing chip into a single chip, namely SoC.

而未来的发展趋势是除高级的超过37英寸的数字电视外，其余尺寸的电视都会采用高度集成的单芯片设计，信号解调芯片、视频控制芯片、MPEG-2解码芯片、视频处理芯片、HDMI接口芯片和音频处理都会集成在一片芯片上。

Results of grafting trial shows: the budding survival rate on hybrid UCB-I was higher commonly than that on the Pistacia atlantica Desf; On two rootstocks, one-year-old branch performed better than twoyear-old stem; In mid August, the highest budding survival rate was attained with two rootstocks; After treatment with 50、100ppm IBA and 50ppm 6-BA, the budding survival rate on hybrid UCB-I was decreased, but the budding survival rate on Pistacia atlantica was increased evidently, particularly it has been increased 22. 8％ by treatment of 100ppm IBA.

阿月浑子嫁接试验结果表明：在杂种UCB-I上的芽接成活率普遍高于在大西洋黄连木上的芽接成活率；两种砧木一年生枝上的芽接成活率均高于二年生主干上的芽接成活率；8月中旬在两种砧木上的芽接成活率均最高；用50、100ppm IBA和50ppm 6-BA处理接芽后，均可显著提高大西洋黄连木上的芽接成活率，尤其100ppm IBA处理可提高其嫁接成活率22.8％，但上述处理都降低了在UCB-I上的芽接成活率。

Currently, digital TV mainly has about seven chips, like Signal demodulator chip, video-control chip, MPEG-2 decode chip, video processing chip, HDMI interface chip, audio frequency treatment chip and audio frequency amplification chip.

目前数字电视里主要芯片有信号解调芯片、视频控制芯片、MPEG-2解码芯片、视频处理芯片、HDMI接口芯片、音频处理与音频放大芯片，也就是大约7片IC。

与chip budding相关的网络解释 [注：此内容来源于网络，仅供参考]

chip budding：嵌木芽接

electric arc cutting 电弧切割 | chip budding 嵌木芽接 | core dump 存储器清除 存储器内容更新 主存储器(全部, 部分)信息转储

chip budding：嵌合芽接

chip bucket ==> 切屑桶 | chip budding ==> 嵌合芽接 | chip cap ==> 木刨压板