查询词典 wafer bread

These results provide a theoretical guide to further understanding of the material removal mechanism in wafer CMP.

本文的研究结果可为进一步研究硅片CMP时的材料去除机理提供理论参考依据。

Where the batter has run down the sides to the centre there will be a little circle of spongy mixture, rather like a crumpet, while the curved edge is very thin, crisp and wafer-like.

而李昌镐已经撞到两侧向中心将有一个小圆圈海绵状混合物，而像表示出了，而弯曲的优势是非常薄，脆和晶圆等。

The fabrication processes for nano-silicon-tips using a (100) single crystal silicon wafer by the anisotropic wet etching in the KOH etchant were designed. Based on the experiment and the model of {411} crystal planes, the crystal planes of silicon tips were analyzed. Through discussing the effect of the mask direction on tip shapes, the process parameters to get high aspect ratio nano-silicon-tips were achieved.

设计了硅尖制备的工艺流程，采用KOH溶液湿法各向异性腐蚀(100)单晶硅的方法制备硅尖，根据实验结果和{411}晶面模型，分析了硅尖侧壁的组成晶面，讨论了掩模偏转方向对硅尖形状的影响，得到了制备高纵横比纳米硅尖的工艺参数。

The fabrication processes for nano-silicon-tips using a (100) single crystal silicon wafer by the anisotropic wet etching in the KOH etchant were designed.Based on the experiment and the model of {411} crystal planes,the crystal planes of silicon tips were analyzed.

设计了硅尖制备的工艺流程，采用KOH溶液湿法各向异性腐蚀(100)单晶硅的方法制备硅尖，根据实验结果和{411}晶面模型，分析了硅尖侧壁的组成晶面，讨论了掩模偏转方向对硅尖形状的影响，得到了制备高纵横比纳米硅尖的工艺参数。

Universal Knee Type Milling machine X6135 is a universal lifts horizontal milling machine, apply to the cylindrical cutter, wafer cutter, angle cutter, molding cutter bar and a flat cutter, and so on, slant, trench, cut off and wait until the forming of Processing.

卧式铣床X6135是一种卧式万能升降台铣床，适用于圆柱铣刀、圆片铣刀、角度铣刀、成型铣刀及棒状铣刀等来进行平面、斜面、沟槽、切断及成形面等到的加工。

The numerical results show that the photoconductive decay curve for minority carriers of the wafer can be expressed by the sum of the first mode and the second mode of this solution.

数值计算结果表明，薄片的少子光电导衰退曲线可以用这种解的一次模和二次模之和来表示。

The effect of rapid thermal processing on oxygen precipitates profile and denude zone in Czochralski silicon wafer during simulating CMOS processing is investigated.

本文研究了快速热处理工艺在模拟的CMOS热处理工艺中对直拉硅单晶中氧沉淀和洁净区的影响。

Newer processes such as chemical mechanical polishing and silicon wafer dicing can be better understood as tribological processes.

更新的过程，例如化学机械擦亮和掷骰子赌博的矽片，可能被作为tribological 过程理解得好。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

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Silicon wafer and DLC substrates were used to study the effect of substrates on spreading.

用硅片和DLC膜研究了基体的影响。

Cable dampener cannot be rolled up but must be hung over the cable.

缆帆不能被卷起，必须保证处于展开状态

"This skylark is a present from my master," he says.

"这只云雀是我主人献上的礼物。"他说。