查询词典 wafer bread

And one loaf of bread, and one cake of oiled bread, and one wafer out of th

29：23 再从耶和华面前装无酵饼的筐子中取一个饼，一个调油的饼和一个薄饼

And from the basket of unleavened bread that was before Jehovah, he took one unleavened cake and one cake of oiled bread and one wafer, and placed them on the fat portions and on the right thigh.

8：26 再从耶和华面前装无酵饼的筐子中取一个无酵饼，一个调油的饼和一个薄饼，都放在脂油和右腿上

In the process, the wafer is subjected to a heat-treatment to form crystal lattice vacancies in the wafer.

在本工艺中，对晶片进行热处理以形成晶格空位，该空位在硅主体中形成。

Five novel torsion-mirror optical actuators including double-beam thickness differential structure with single torsional axis, double flexible folded-beam structure with single torsional axis, double-beam vertical torsion comb structure with single torsion axis, four-beam differential compound-micromirror structure with double torsional axis and the combined structure of the four basis forms above, are brought forward. All of these devices could be fabricated by the same silicon micromachining process we have developed. The deformation compensation design with local enhancement for the thin torsional beam which is the key structure of these devices is also put forward to improve the reliability. The three-dimension solid model and two-dimension reduced order model of the torsion-mirror optical actuator are established and then the numerical simulations for evaluating the device characteristics of the statics, dynamics, electrostatic field, mechanical and electrostatic coupling, fluid and solid coupling are carried out to optimize the structure design. Furthermore, three optical fibre clamping structures which could be integrated monolithicly are designed and analyzed to improve the optical coupling capability. 4. Three flexible process flows combined with bulk silicon micromachining and surface silicon micromachining are brought forward to fabricate these novel single-crystal silicon or polysilicon torsion-mirror optical actuators by using the same lithography masks for both SOI wafer and regular silicon wafer. A series of important process experiments are carried out to optimize the process parameters and the process flows. Some novel and typical process phenomena which occurred during the microfabrication are analyzed and then the corresponding solutions are put forward. 5. A MEMS dynamic testing system which exploit blur image synthetic technique, stroboscopic image matching technique, stroboscopic mirau microscopic interferometry technique and microscopic laser dopper vibrometer technique is set up to measure three-dimension and six-freedom micro motions of any MEMS devices with nanometer resolution.

在对硅微机械扭转镜光致动器的光机电特性系统地理论研究的基础上提出了硅微机械扭转镜光致动器的结构设计准则。3、提出了单轴双梁厚度差分结构、单轴双柔性折叠梁结构、单轴双梁垂直扭转梳齿结构、双轴四梁差动复合微镜结构以及以上四种基本结构组合后的衍生结构等五种工艺加工技术兼容的新型的硅微机械扭转镜光致动器，对器件关键结构薄厚度、高耐疲劳扭转梁进行了局部加强的变形补偿设计，建立了器件的三维实体模型以及两维降阶模型，对提出的新结构硅微机械扭转镜光致动器进行了系统的静力学、动力学、静电场、力电耦合和流体固体耦合的建模仿真与优化设计，同时设计并分析了三种可实现单芯片集成的弹性光纤定位夹紧结构。4、提出了组合体硅微加工技术与表面硅微加工技术、兼容同一套光刻版图、可分别基于SOI 晶片和普通Si 晶片、适应于制造提出的各种新结构单晶硅和多晶硅硅微机械扭转镜光致动器的三套柔性加工工艺流程，开展了一系列重要工艺步骤的单项工艺试验，对工艺流程与工艺参数进行了优化，针对加工过程中出现的具有普遍意义的典型工艺问题进行了讨论和分析，并提出了解决方法。5、创新性地将模糊图像合成技术、频闪图像匹配技术、频闪Mirau 显微干涉技术与显微激光多普勒测振技术有机结合，建立起了一套周期运动测量与瞬态运动测量相结合、单点运动测量与全视场运动测量相结合、满足不同MEMS 器件各种动态测试要求的集成的MEMS 三维六自由度微运动精密测量系统。

The wafer/interposer assembly is reflowed, or cured, to form the electrical connection between the circuitry on the interposer layer (34) and the circuitry on the wafer.

将圆片/插入器组件反流或固化以在插入器件层上的电路(34)和圆片上的电路之间形成电连接。

The epitaxial wafer is equipped with two detached quantum traps, by preparing three electrodes on the p-type layer I, the n-type layer and the p-type layer II, the two quantum traps can respectively emit light with different wavelength under applied voltage, after the epitaxial wafer is prepared to LED chip, mixing light with different wavelength emitted by the quantum trap I and the quantum trap II are obtained, or a single-color light emitted by the quantum trap I or the quantum trap II is obtained, thereby greatly extending application area of the LED.

本发明外延片设有两个分隔的量子阱，通过在p型层I、n型层、和p型层II制作三个电极，可使两量子阱在外加电压下分别发射不同波长的光，该外延片制作成LED芯片后，可获得由量子阱I和量子阱II发出的不同波长的混合光，或者分别发出由量子阱I或量子阱II产生的一种颜色的单色光，大大拓展LED的应用范围。

Provide test and measurement solutions for device characterization and monitoring semiconductor wafer processing, including DC to RF Automated Parametric Test systems, Wafer Level Reliability systems, and I-V/C-V test systems.

我们的产品可用于半导体特性分析、参数测试、半导体晶片生产工艺监控，覆盖从DC到RF的自动参数测试系统，晶片可靠性系统和I-V/C-V测试系统。

An array of permalloy core solenoids is micromachined as microactuators on (100) silicon wafer. Then anisotropic etching of silicon in KOH solution forms the U-grooves beside the microactuators. The micromachining difficulties from the coexistence of 3-D MEMS devices and deep grooves on chip are overcome successfully. Then two fibers and permalloy piece are assembled onto the wafer together with the microstructures finishing the prototype of the new type MEMS VOA. Third, the inductance, resistance and Q value of the microfabricated solenoids are measured in the frequency range of 1-40 MHz.

第二，新开发了使用SU-85的正胶、负胶复合微加工工艺，在（100）硅片上加工了新型可变光衰减器的铁芯MEMS螺线管型电磁微执行器阵列；用KOH水溶液对（100）硅片进行湿法刻蚀，在电磁微执行器旁边微加工了V形槽结构组合，开发了单片集成三维MEMS器件和深槽的微加工关键技术；然后经过微装配制作出了电磁驱动的光纤偏移型MEMS可变光衰减器的样机。

Multicrystalline wafer: The production capacity is expected to reach 8000MW in 2012, and become the major production base of multicrystalline wafer in the world.

多晶硅片：2012年形成8000MW以上产能，成为世界主要太阳能多晶硅片生产基地。

ABSTRACT The preparation of photoluminescent porous silicon wafer and the seperation of photoluminescent porous silicon films from silicon wafer were reported in this paper.

本文从发光多孔硅的制备出发，通过系统的分析测试，对多孔硅的发光机理进行了探讨。

This is the inheritance of the tribe of the children of Issachar according to their families, the cities and their villages.

19：23 这些城并属城的村庄就是以萨迦支派按着宗族所得的地业。

I've have enough of your garbage.

我听了你的废话。