查询词典 semiconductor

A semiconductor chip consists of two parts, one is called P-type semiconductor where holes dominate the region, and the other part is N-type semiconductor where is dominate by electrons.

半导体晶片由两部分组成，一部分是P型半导体，在它里面空穴占主导地位，另一端是N型半导体，在这边主要是电子。

The C2 selectivity over p-type semiconductor membranes is higher than that over n-type semiconductor membranes and the order of C2 selectivity is consistent with that over p-type semiconductor membranes.

但p型半导体膜上的C2烃选择性比n型半导体膜上的要高；p型半导体膜上C2烃选择性与其电导率大小顺序相一致。

Provided is a wafer level CSP semiconductor device with the same size as a semiconductor substrate, in which the orientation of a semiconductor device cut into individual pieces and product information can be identified by a mark, indicating the orientation and the product information formable, irrespective of the size, shape and the number of terminals of the device without increasing the number of manufacturing processes, and its manufacturing method.

本发明提供一种在与半导体衬底尺寸相同的晶片级CSP半导体器件领域中，能够利用表示半导体器件的方向及产品信息的标记，来识别被切成单个的半导体器件的方向及产品信息的半导体器件及其制造方法，其中，该标记能够在与半导体器件尺寸、形状及端子数目无关，且在不增加制造工序数目的情况下形成。

A semiconductor device including a high voltage element and a low voltage element, including: a semiconductor substrate having high voltage element region where the high voltage element is formed, and a low voltage element region where the low voltage element is formed; a first LOCOS isolation structure disposed in the high voltage element region; and a second LOCOS isolation structure disposed in the low voltage element region, wherein the first LOCOS isolation structure includes a LOCOS oxide film formed on a surface of the semiconductor substrate and a CVD oxide film formed on the LOCOS oxide film, and the second LOCOS isolation structure includes a LOCOS oxide film.

提供一种在确保高耐压元件的高耐压特性的同时使高耐压元件和低耐压元件具有良好特性的半导体装置。具有高耐压元件和低耐压元件的半导体装置包含：规定了形成高耐压元件的高耐压元件区和形成低耐压元件的低耐压元件区的半导体衬底；在该高耐压元件区设置的第一LOCOS隔离结构；以及在该低耐压元件区设置的第二LOCOS隔离结构。第一LOCOS隔离结构由在该半导体衬底的表面上形成的LOCOS氧化膜和其上形成的CVD氧化膜构成，第二LOCOS隔离结构由LOCOS氧化膜构成。

The invention discloses an optical-fiber all-optical code converter, comprising a temperature control circuit as well as optical-fiber Mach-Zed interferometer, heat sink, semiconductor refrigerator, thermosensitive resistor and radiator, where the interferometer is composed of two cascaded 3dB couplers on the heat sink, the relation between length difference delta L of two arms of the interferometer and generated delay time difference delta T is that delta L=c.delta T/n, where c is light velocity in vacuum and n is refractive index of optical fiber; the thermosensitive resistor is used to detect temperature of interferometer, the temperature control circuit is used to compare feedback voltage of the thermosenstive resistor with a given voltage to regulate working current of the semiconductor refrigerator, and the semiconductor refrigerator refrigerates or heat two arms of the interferometer by the heat sink.

本发明公开了一种光纤型全光码型转换器，它包括温控电路和位于密封盒内的光纤型马赫-泽德干涉仪、导热热沉、半导体制冷器、热敏电阻以及散热片；干涉仪由位于导热热沉上的二个3dB耦合器级联而成，两臂的长度差ΔL与产生的延时差ΔT之间的关系为ΔL＝c。ΔT/n，c为真空中光速，n为光纤折射率；热敏电阻用于对干涉仪的温度进行探测，温控电路用于比较热敏电阻反馈的探测电压和设定电压，对半导体制冷器的工作电流进行调节，半导体制冷器通过导热热沉对干涉仪两臂同时进行制冷或加热。

An external-cavity semiconductor laser was built by using a semiconductor laser, collimating cylindrical column lens for fast axis beam and a volume Bragg grating as a feedback element to get semiconductor lasers wavelength locked to the Bragg wavelength of the VBG.

用体布拉格光栅作为反馈元件与瓦级半导体激光器以及快轴准直柱透镜构成一个可以将半导体激光器的工作波长稳定在体布拉格光栅布拉格波长处的外腔激光器。

Semiconductor Product category Ultrasonic welding has: Ultrasonic Wire Welder Series, ultrasonic gold wire bonder series, enameled wire electric spot welder series; semiconductor back-up processes Product categories: LED computer tester, dot-matrix plate detector, the expansion of machine, paste membrane and dispensing, such as semiconductor production equipment.

超声波半导体焊接产品类有：超声波铝丝焊机系列、超声波金丝球焊机系列、漆包线电点焊机系列；半导体后备工序产品类：LED电脑检测仪、点阵板检测仪、扩张机、贴膜机和点胶机等半导体生产设备。

To present a manufacturing method of semiconductor device using adhesive sheet for wafer processing or adhesive sheet with semiconductor wafer, and a semiconductor device obtained in this manufacturing method.

进而本发明还提供使用了晶圆加工用粘合片或带半导体晶圆的粘合片的半导体元件的制造方法、以及通过该制造方法得到的半导体元件。

The semiconductor sensing element is fabricated from a suitable semiconductor material such as galium arsenide.

半导体传感单元是编造一个合适的半导体材料，如砷化殃。

We have conducted measurements in heterodyne detection including superconductor mixers and semiconductor harmonic mixers, direct detection including InSb semiconductor bolometer and Golay Cell, and some materials which could be permeated by terahertz waves.

测得的频谱分辨率可达约1 GHz。我们已经测量的器件有：超导隧道结混频器和工作于常温的半导体肖特基谐波混频器，InSb半导体Bolometer和Golay Cell直接检测器，各种频率的THz信号源，和一些能透过THz的材料等。

After explaining total design of automated test system for microcircuit , the thesis introduces GPIB standard .

文章在说明了微电路模块自动测试系统的总体设计后，对GPIB标准进行了介绍。

He interceded in my behalf.

他替我说情。