- 更多网络例句与镀层相关的网络例句 [注：此内容来源于网络，仅供参考]
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Moreover, the pre-treatment and post-treatment processes for the steel sheet subject to continuous zinc plating were also discussed. Results showed that the alkaline zincate plating process had many advantages over conventional alkaline cyanide zinc plating process, including high current efficiency, good throwing power, and strung adhesion strength of the coating.
结果表明，该工艺电流效率高（锌离子含量16~24g/L时，电流效率可提高约20%，镀液均镀能力好（宽度为1m的镀锌薄板，中心点厚度与边缘厚度差不大于10%，镀层结合力优良（将试片180°任意弯曲，镀层无起皮、剥落现象；在烘箱中加热至180-200℃，保温60min，冷水中急剧冷却，镀层无突起、鼓泡、剥落现象），所镀得的镀锌薄钢板适合于钝化和彩涂等后处理。
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In addition, there are bond areas between the new and the primary coverage because of the growing up of the plating coat, which may lead to the emergence of micro crack on the coating owing to such causes as too big or uneven impact during plating process, little distortion of global granular zinc dust inside the plating coat, less tight coalescence of the zinc dust flecks.
由于形成镀层的过程处在酸性环境，在镀层增厚过程中不可避免把酸性溶液包裹在镀层里面，酸性溶液会与金属基体和镀层反应，产生氢气，必然会寻找通道选出，形成微气孔；镀层是逐渐形成的，新生镀层与原有镀层之间存在结合面；镀覆过程由于撞击力过大或者不均匀，镀层内部球形颗粒状锌粉变形较小，球形颗粒与球形颗粒的结合不严密等，这些原因会导致镀层产生微裂纹。
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The results show that complexing agent greatly effects on film's density. For the double complexing agents solution system based on citric acid, the solution with lactic acid and citric acid produced most compact film with lowest porosity; and for the double complexing agents solution system based on butane diacid, the solution with butane diacid and malic acid made most compact film with lowest porosity.
研究结果表明：络合剂对镀层的致密度影响显著，对于以柠檬酸为基的双络合剂体系镀液来讲，乳酸-柠檬酸双络合剂体系镀液获得的镀层致密度最好，具有最低的气孔率；而对于以丁二酸为基的双络合剂体系镀液来讲，丁二酸-苹果酸双络合剂体系镀液获得的镀层致密度最好，具有最低的气孔率。
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The pore distribution in the direction of coating thickness was self-existent and could not join to intercommunicating pore.The pore diameter was very tiny so that it could prevent hydrotropic solution entering into the pore.
机械镀锌的形层过程既没有热镀锌那样的高温冶金反应，也没有电镀锌那样的电沉积效应，镀层是常温常压下利用化学吸附沉积和机械碰撞使金属锌粉在工件表面镶嵌堆积而成[1]，所以人们认为机械镀锌镀层的致密性要低于电镀和热镀锌镀层，但机械镀锌镀层又表现出良好的耐腐蚀性能。
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The anodic behavior of electrolytic nickel anode in nickel sulfamate plating Solution was investigated,using anodic polarization curves,metallographic observation of cross-sections of nickel deposits,Hull Cell tests with solutions with and without Cl-,F-,bending tests with five solutions of different compositions,and sulfur content analysis in nickel deposit with mass spectrometry.
采用极化曲线、金相观察、赫尔槽电镀试验、弯曲试验和质谱分析方法，研究了氨基磺酸盐镀镍的阳极行为，证明了当在氨基磺酸盐镀液中使用电解镍阳极时，其活化峰值电流和镀液组成有很大的相关性，当镀液中不含F-和Cl-时其阳极活化峰值电流小，阳极处于极化状态，或相当大面积处于极化状态，使氨基磺酸根在极化的阳极表面氧化，从而使含硫化合物夹附于镀镍层，形成镀层内应力，并使镀层成为层状结构，并出现半光亮的外观。
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A kind of high speed sulphamate nickel-based electrolyte is chosen as basal electrolyte, the influences of plating process parameters on the micro-hardness of the nickel deposit have been studied by orthogonal experiments. It is concluded that the main influence factors on the micro-hardness of the nickel deposit are sulphamate concentration and electrolyte temperature, the deposition rate and quality in single-pulse mode are higher than that in DC power and double-pulse mode.
选择以氨磺酸型高速镀镍液作为基础镀液，通过正交试验研究了电镀工艺规范对镀层显微硬度的影响关系，试验结果表明：镀液主盐氨基磺酸镍浓度和镀液温度是影响镀层硬度的显著因素，单脉冲供电模式下的电镀沉积速率和镀层质量优于直流和双脉冲模式。
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The surface morphology was observed by means of SEM. The EDX results show that the coating's sulphur content increase and cobalt content decrease with the sulphourea concentration increasing. A gradient structure with solphur content increase from inside to outside was formed.
用SEM观察镀层表面形貌，面能谱测试镀层的结果表明，随着镀液中硫脲浓度的升高，镀层中S元素的含量逐渐提高，钴元素的含量逐渐降低，镀层由内到外形成了S元素含量不断增加的梯度结构。
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It is found that the structure of the ternary electroless Ni-W-P coating is greatly influenced by W content in the deposit. It is also found that the requisite content of phosphorus for amorphous Ni-W-P structure is less than that of Ni-P binary alloy coating, and the more tungsten exists, the less phosphorus is required. The hardness of the deposits will be enhanced as the deposit structures are changed from amorphous to mix-or nanocrystalline structures. The corrosion resistance of Ni-W-P ternary alloy is improved as W content increased, and the passivation of amorphous deposits is formed more easily than that of mix-structure and nanocrystalline deposits.
研究发现，化学镀Ni-W-P三元合金镀层的结构受镀层中钨含量的影响较大，非晶态Ni-W-P三元合金镀层所需磷含量较非晶态Ni-P二元镀层所需磷含量要低，并且钨含量越高，所需磷含量越少；镀层硬度随镀层结构从非晶态→混晶态→纳米晶态转变而增加；镀层的耐蚀性随镀层中钨含量增加而变好，且非晶态镀层较混晶态和纳米晶态镀层更易形成钝化区。
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In this bath, maleic acid was an inhibitor, when its concentration was kept at 20 mg/L, the deposition rate could reduce to 6.17μm/h, the content of nickel decreased to 1.74% and the resistivity was 7.51μΩ·cm; Potassium ferrocyanide inhibited deposition of copper, when its content was 0.5 ppm, the deposition rate decrease to 3.38μm/h, the content of nickel was 2.03%, the resistivity can reduced to 5.41μΩ·cm, the copper deposits also had higher (111) plane orientation. Thiourea was also an inhibitor in this system, when its concentration was kept at 0.8 ppm, the deposition rate was 4.72μm/h, the content of nickel in the film was 1.20%, the resistivity can reduced to 5.46μΩ·cm, at the same time, the deposition at (111) plane orientation become more favorable.
结果表明，马来酸在该体系中是抑制剂，当其浓度为20 mg/L时，镀速降为6.17μm/h，镀层镍含量降为1.74%，表面电阻率降为7.51μΩ·cm，铜层颗粒细小均匀，更有利于在(111)面上的结晶；亚铁氰化钾的加进可以明显降低镀，当其浓度为0.5 ppm时，镀速为3.38μm/h，镀层镍含量降为2.03%，表面电阻率降为5.41μΩ·cm，铜层颗粒细小均匀，(111)晶面衍射峰增强；硫脲在体系中也显示为抑制剂，当其浓度为0.8 ppm时，镀速降到4.72μm/h，镀层镍含量为1.20%，表面电阻率降为5.46μΩ·cm，形成的铜颗粒很小，同时(111)晶面衍射峰增强，有利于铜在(111)面上结晶。
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Since this product can be used with the tin in order to melting the surface, however we did not acquire the technology skill to melt the tin, which was caused the existence of non-uniform thin coating on the phenomenon.Our engineering staffs have reviewed and this problem has been solved, it is no longer thin coating melts the surface coating.Eventually we led our products TKEKK with pased of current 50A, it has obtained to the minimum partial fuse time.
因为此产品所用可熔体其表面是镀锡，因当时我们公司掌握的可熔体镀锡技术不成熟，导致所生产出的可熔体表面镀层存在镀层偏薄不均匀的现象，最终导致给我们的TKEKK产品通50A电流时，熔断时间偏下限，对此，我公司的工程人员通过技术改良，现已解决了此问题，现生产出的可熔体表面镀层已不存在镀层偏薄，不均匀的现象。
- 更多网络解释与镀层相关的网络解释 [注：此内容来源于网络，仅供参考]
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Nickel coating and the like：镀镍及类似镀层
Triplex plated coating三层镍 | Nickel coating and the like镀镍及类似镀层 | Normal coating装饰性镀铬
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anodic coating：阳极性镀层
33 阳极极化anodic polarization | 34 阳极性镀层anodic coating | 35 迁移数transport number
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anodic coating：阳极镀层
anodic brightening 阳极抛光 | anodic coating 阳极镀层 | anodic corrosion 阳极腐蚀
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buttering：熔接缝预镀层
butterflyvalve 蝶形阀 | buttering 熔接缝预镀层 | buttjoint 对接
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chromium plating：镀铬 铬镀层
chromium plate | 涂铬层 | chromium plating | 镀铬 铬镀层 | chromium polish | 铬抛光剂
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coated stone：镀层宝石,涂层宝石
coated stone 带皮钻石,带壳钻石 | coated stone 镀层宝石,涂层宝石 | cobalt 钴,钴类原料
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outgrowth：悬出,横出,侧出 (台) 镀层情况
Outgassing 出气,吹气 (台) 逸气 | Outgrowth 悬出,横出,侧出 (台) 镀层情况 | Overhang 总浮空 (台) 镀层突出
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Plating：镀层
镀铬的 chromium-plated, chrome-plated | 镀层 plating | 锻造,型钢 swage
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ternesheet,terneplate：铅锡镀层板
热浸镀铝板hotdippedaluminumcoatedplate | 铅锡镀层板ternesheet,terneplate | 镀锡板tinplate
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coating thickness gauge：镀层厚度规
镀层厚度计 coating thickness meter | 镀层厚度规 coating-thickness gauge | 同轴度 coaxality, coaxiality