- 更多网络例句与电淀积相关的网络例句 [注：此内容来源于网络，仅供参考]
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Resistance pure water system, 3-waste treatment system, and shock-proof working-table, and about 80 sets of micro-electrical-mechanical technical equipment are installed, including AMS200 ICP plasma etching system, ICP-2B etching machine, AWB04 bonding machine, MA6/BA6 Karlsus double-face photolithography machine/bonding machine, POLI-400 chemical-mechanical-polishing tool, WL2040 aluminum-wire press welder, OPTI CAOT 22i decktop precision spin coasting system, ZSH406 automatic dicing saw system, DQ-500 plasma photoresist-removing machine, HXS150S automatic centrifugal spinner, AXTRON MOCVD metal organic chemical vapor deposit system, 4470 micro-control 4-tube diffusing furnace, type 4371 LPCVD low pressure chemical vapor deposit system, OMICRON MBE molecular beam epitaxy system, JS-3X100B magnet-control spattering equipment, PECVD-2E plasma deposit apparatus, ZZSX500C electron-beam vapor equipment, JC500-3/D magnet-control spattering-coating machine, H63-14/ZM quartz-tube cleaning machine. Measurement instruments include OLS1100 Confocal Laser Scanning Microscope, DEKTAKIII Surface Profiler, D41-11A/ZN 4-probe resistance test instrument, Nikon L150 metallurgical microscope, and so on.
中心现有80多台各种微机电工艺设备，如AMS 200深硅等离子体刻蚀系统、ICP-2B刻蚀机、AWB04键合机、MA6/BA6 Karlsuss双面光刻机和键合机、POLI-400化学机械抛光机、WL2040铝丝压焊机、OPTI CAOT 22i喷涂胶机系统、ZSH406全自动划片机、DQ-500等离子去胶机、全自动清洗甩干机、AXTRON MOCVD金属有机物化学气相沉积系统、4470微控四管扩散炉、4371LPCVD低压化学沉积系统、OMICRON分子束外延系统、JS-3X100B磁控溅射台、PECVD-2E等离子淀积台、ZZSX500C电子束蒸发台、JC500-3/D磁控溅射镀膜机、石英管清洗机，以及多种常用测试仪器，如OLS1100激光共聚焦显微镜、DEKTAK-III台阶测量仪、D41-11A/ZN四探针电阻测试仪、Nikon L150金相显微镜等。
- 更多网络解释与电淀积相关的网络解释 [注：此内容来源于网络，仅供参考]
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Electroless Deposition：化学淀积
electroetching 电蚀刻 | electroless deposition 化学淀积 | electroless plating 化学淀积
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electroetching：电蚀刻
electroerosion machining 电腐蚀加工 | electroetching 电蚀刻 | electroless deposition 化学淀积
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electrostenolysis：膜孔电淀积 细孔隔膜电解
electrosteel 电炉钢 | electrostenolysis 膜孔电淀积 细孔隔膜电解 | electrostethograph 电心音描记器 心音描记仪
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electrodeposited copper powder：电解铜粉,电(沉)积铜粉
electrodeposited coating || 电镀层,电解沉积层 | electrodeposited copper powder || 电解铜粉,电(沉)积铜粉 | electrodeposition || 电解沉积,电淀积,电解镀层,电镀
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electroformed diamond blade：电铸钻石刀片
electrodeposition 电[淀]积 | electroformed diamond blade 电铸钻石刀片 | electrofusion 电熔