diamonded

diamonded的基本解释

-

[变形] diamond的过去分词

n.

钻石, 菱形

与diamonded相关的网络例句 [注：此内容来源于网络，仅供参考]

XRD and TEM confirmed that the novel mesoporous silica has a diamonded face centered cubic structure with Fd3m symmetry, which was first reported up to date.

同时对它的物理性能包括比表面积、孔容和孔径通过N〓吸附-脱附技术进行了测定，考察了合成条件对其结构形成的影响。

Then processed copper polished by diamonded grinding paste,it could be satisfied ofrthe Ni-Pd-P alloy thin film growth

加工后的铜片再经金刚石研磨膏抛光可快速获得满足Ni-Pd-P合金薄膜生长用的铜片衬底表面。

XRD and TEM confirmed that the novel mesoporous silica has a diamonded face centered cubic structure with Fd3m symmetry, which was first reported up to date.

论文的第五章，用三头季铵盐阳离子表面活性剂作结构导向剂，用硫酸锆作无机锆源，在水热条件下合成了一种新的类似于SBA-1分子筛的立方介观结构（Pm3n）的硫酸氧锆复合材料。

The precision lapping technology to machine the copper substrate using semi-fixed abrasive plate was studied. The surface roughness and material removal rate as the evaluation of indicators, the influences of the different lapping parameters on the surface roughness and material removal rate were discussed and analyzed. Experimental results indicated that the copper substrate could be efficiently machined by semi-fixed abrasive plate of 800(superscript #) SiC abrasive, and the initial roughness Ra of a machined surface could be improved from 0.553μm to 0.28μm in 10min, produced an ideal rarely scratch surface. Then processed copper polished by diamonded grinding paste, it could be satisfied for the Ni-Pd-P alloy thin film growth.

主要研究半固着磨具精密研磨非晶态Ni-Pd-P合金薄膜铜片衬底，以铜片衬底的表面粗糙度和材料去除率为评价指标，探讨了研磨过程中不同的工艺参数对铜片表面粗糙度和材料去除率的影响结果表明：用800 SiC半固着磨具对铜片衬底进行研磨加工，10min后铜片表面粗糙度Ra可由0553μm减小到0.28μm，同时表面无深划痕：加工后的铜片再经金刚石研磨膏抛光可快速获得满足Ni-Pd-P合金薄膜生长用的铜片衬底表面。