plating bath
- plating bath的基本解释
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n.
电镀槽, 镀浴
- 更多网络例句与plating bath相关的网络例句 [注：此内容来源于网络，仅供参考]
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A method of determination for wetting Agent content in plating bath is described by surface tension or wetting angle technique. A simple and practical method is provided for plating technology and research.
本文介绍了用测定镀液表面张力或润湿角的方法来确定镀液中润湿剂的含量，为电镀工艺和电镀的研究工作提供了一种简便可行的物理化学测试方法。
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Another type of acid copper plating bath, for printed wire board plating contain organic additives that promote grain refinement and leveling.
另外一种用于线路板酸性镀铜的，槽液中包括用于加速晶粒细化的有机添加剂。
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Meanwhile, determined effect of the composition in pre-plating bath on tin coating thickness, surface microtopography and coating binding power throught single factor experiment of pre-plating solution.
同时通过对预镀液的单因素实验，确定了加入预镀的化学镀锡工艺各种成分对厚度、表面型貌以及镀层结合力的影响。
- 更多网络解释与plating bath相关的网络解释 [注：此内容来源于网络，仅供参考]
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platina：白金
platform 平台 | platina 白金 | plating bath 电镀槽
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platform weighing machine：平台秤
台秤 platform scale | 平台秤 platform weighing machine | [电]镀槽 plating bath
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salt bath furnace：盐浴炉安全操作规程成都
11. 刷镀电源安全操作规程成都 Brush Plating Power | 12. 盐浴炉安全操作规程成都 Salt Bath Furnace | 1. 7-KDG逆变式空气等离子弧切割机安全操作规程 Arc Plasma Cutter